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InsulectroInsulectro
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Contact
  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact

CHEMISTRY

Insulectro supplies all the chemistries required to manufacture circuit boards, as well as other products that support similar industries like chem milling.

About CHEMISTRY

Insulectro supplies chemistry from three world-class manufacturers, DuPont™, Focus Tech, and Shikoku. With such a wide varitey of manufacutures, Insulectro can offer the best solutions for any process. We also have the abiltiy to make custom chemistries for any unique needs.

custom services

  • Process Audits
  • Process Control and Equipment
  • FTIR Analysis
  • Profilometry Analysis
  • EDAX/SEM Analysis
Product Lines:
  • Dryfilm / Soldermask Developer​
  • Inner Layer Dryfilm Resist Strip​
  • Outer Layer Dryfilm Resist Strip​
  • Tin Stripper​
  • Antifoam​
  • Micro Etch​
  • Alternative Oxide
  • OSP​
  • DC Copper Plating
  • Electroless Copper
  • ENIG​
  • VIA Fill
  • Pulse Plating
  • Cupric Etch​

Dry Film / Soldermask Developer

Focus Tech DV-6600

600 g/L potassium carbonate developer solution.

Product Details
Focus Tech DV-6450

450 g/L potassium carbonate developer solution.

Product Details

Inner Layer Dry Film Resist Strip

Focus Tech FS-60/IL

Affordable caustic blend dry film resist stripper. Proprietary cleaner and anti-tarnish to maintain clean equipment stain free copper.

Product Details
Focus Tech FS-63/IL

Fast stripping dry film resist stripper. Proprietary cleaner and anti-tarnish to maintain clean equipment stain free copper.

Product Details

Outer Layer Dry Film Resist Strip

Focus Tech FS-72/OL

High-loading dry film stripper. Proprietary cleaner and anti-tarnish to maintain clean equipment stain free copper.

Product Details
Focus Tech FS-79/OL

Solvent-based stripper to maximize stripping capability. Proprietary cleaner and anti-tarnish to maintain clean equipment stain-free copper.

Product Details

Tin Stripper

Focus Tech TSN-3000

Affordable tin stripper ideal for tin or tin lead stripping.                                                                      

Product Details
Focus Tech TSOx-3001

Ammonium Bifluoride / hydrogen peroxide tin stripper for stripping tin without attacking nickel.

Product Details
Focus Tech TSN-3100

High-loading tin stripper which can also achieve faster stripping speeds.                                             

Product Details

Antifoam

Focus Tech AF-6

Increased defoamer capabilities for higher loading processes.

Product Details
Focus Tech AF-7

Affordable, free rinsing antifoam for most processes.

Product Details

Micro Etch

Focus Tech ME-550

Proprietary powdered persulfate.

Product Details
Focus Tech ME-560

Powder Potassium monopersulfate (Oxone®).

Product Details
Focus Tech ME-570

Liquid proprietary powdered persulfate.

Product Details
Shikoku Glibrite® GB-4300

Proprietary peroxide/sulfuric micro etch. Engineered to maximize soldermask and dryfilm adhesion.

Product Details

Alternative Oxide

Focus Tech Resin Bond RB-320

Affordable, low etch, alternative oxide.                      

Product Details
Shikoku Glicap® GC-750

Non-etching oxide alternative. Engineered for High Speed Digital and RF applications.

Product Details

OSP

Shikoku Glicoat®-SMD F2(LX)

Best-in-Class OSP coating.

Product Details

DC Copper Plating

DuPont™ COPPER GLEAM™ 2001

Low current density, high aspect ratio; Mid current density, high throughput.

Product Details
DuPont™ COPPER GLEAM™ 125-EX

Low current density, high aspect ratio; Mid current density, high throughput.

Product Details

Electroless Copper

CIRCUPOSIT™ 3000-1

Industry standard for performance and stability.

Product Details
CUPOSIT™ 328-L

Periodic Pulse Technology for HDI Applications.

Product Details

ENIG

DURAPOSIT™ SMT-88

ENIG final finish with excellent solderability performance.

Product Details
AUROLECTROLESS 520

ENIG final finish with excellent solderability performance.

Product Details

VIA Fill

DuPont™ Microfill™ EVF

Reliable via filling technology; multiple variations based on geometries.

Product Details

Pulse Plating

DuPont™ COPPER GLEAM™ CuPulse

Periodic Pulse Technology for HDI Applications.

Product Details

Cupric Etch

Focus Tech Cu-Rep 40

Proprietary rate enhancers afford substantially increased etch rates over generic sodium chlorate, hydrogen peroxide and chlorine gas.

Product Details
Focus Tech Cu-Rep 41
Product Details
Corporate Headquarters

Insulectro
20362 Windrow Drive
Lake Forest, CA 92630
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Call (949) 587-3200

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