ARLON ELECTRONIC MATERIALS
About ARLON ELECTRONIC MATERIALS
Arlon is a global leader in high performance thermoset substrates for mission-critical printed circuit boards manufactured for high endurance and long-life programs. Arlon is recognized for the highest quality standards in the industry and is positioned to support our customers most technological challenges through innovating technologies. Arlon specializes in Polyimide, Low Flow, and CTE-controlled PCB products.
Polyimide Systems for PCBs
Arlon’s 85N is a 250⁰C high glass transition pure polyimide resin system that provides superior thermal resistance to high-temperature end-use electronics. Coupled with the high-temperature stability and the pure resin formulation, 85N is the best choice for high-layer count multilayers with long service life for aerospace, military, space, and other applications where reliable thermal stability is required.
Meets requirements of IPC-4101/40 and IPC-4101/41.
Arlon’s 85HP is the best-in-class 250⁰C high glass transition temperature polyimide resin system available on the market today. This unique blend of polyimide resin and micro-fine proprietary fillers results in superior performance for the most demanding thermal and high-layer applications. Applications for 85HP include mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling and many other high reliability applications.
Validated to three IPC-4101 slash sheets 40, 41, & 43.
Arlon’s 86HP is a revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical, and mechanical performance not found with any other polyimide resin system. 86HP applications include mission-critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in, and automatic test equipment.
86HP meets IPC-4101 slash sheets 40, 41, and 43.
Prepregs for Rigid-Flex and Cavity PCBs
Arlon’s 37N is a 200⁰C glass transition temperature polyimide low-flow resin system designed for bonding multilayer rigid flex, heat sink attachment to MLB’s or other applications where minimal and uniform resin flow is required. 37N can be cured as low as 350⁰F and has excellent thermal stability. Applications include military, aerospace, space, commercial, and industrial PWB electronics.
Meets requirements of IPC-4101/42.
Arlon’s 38N is the second-generation 200⁰C glass transition temperature polyimide low-flow resin system which is designed to improve adhesion and bond strength to Kapton® polyimide films, copper and other metals. Applications include military, aerospace, space, commercial and industrial PWB electronics.
Meets requirements of IPC-4101/42.
Arlon’s 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heat-sinks to multilayer epoxy PCBs. With a high glass transition temperature of 170⁰C, the prepreg can be used in high-performance or high-temperature applications compared to a standard difunctional epoxy low-flow. 49N is well suited for high-layer count rigid-flex applications where z-axis expansion is a concern.
Meets requirements of IPC-4101/26.
Arlon’s 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.
Meets requirements of IPC-4101/126.