Key Properties

  • 86HP is designed for dense circuit configurations due to the anti-CAF performance of over 1000 hours at 85% RH/85⁰C, low-Z-axis expansion of <1% between 50⁰C to 260⁰C for high layer count MLB’s, very high decomposition temperatures of 430⁰C, high thermal conductivity of 0.6 W/mK, low moisture uptake of 0.12% for sensitive climate applications and is ideal for sequential lamination designs using up to seven additional lamination steps.
  • 86HP meets IPC-4101 slash sheets 40, 41, and 43.