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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
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    • Custom Services
    • PumaFast™
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POWER MANAGEMENT

Power Management or designing to current needs

About POWER MANAGEMENT

Ensuring IC packages are designed with sufficient power while increasing density of a board is a tricky problem. There are clever ways to design systems however they might not always work. Designing with special materials gives designers new variables to consider when designing systems with stringent power delivery needs.

custom services

  • PumaFast™
  • Rewinding Services
  • Manufacturing Technical Support
  • Designer Support

Embedded Planar Capacitance

DuPont™ Interra® HK04M

Next generation Planar embedded capacitance power delivery with thinner dielectrics for lower inductance and better power delivery performance.                        

Product Details
DuPont™ Interra® HK04J

Planar Embedded Capacitance power delivery material for electrically demanding boards.                                                                                                                           

Product Details

High Voltage

Isola® IS550H

Halogen-free, low CTE, thermally stable for high temperature and high voltage applications.

Product Details

Copper Foil

Denkai America TOB-III

High reliability electrodeposited copper foil available in thicknesses up to 6 oz. (8.4 mils or 210 microns). Typically in stock up to 4 oz, thicker coppers can be used for high power applications.

Product Details
Wieland Wrought Foil

Also known as Rolled Annealed foil is generally stocked up to 3 oz (105 microns) thick. Rolled foil can be made in much higher thicknesses, up to 400 microns.

Product Details

Insulating Film

Polyimide Film

Saint-Gobain Chemfilm® is lightweight, flexible polyimide film that has excellent heat and chemical resistant properties. Polyimide films are great dielectrics even at elevated temperatures.

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