Power Management or designing to current needs
About POWER MANAGEMENT
Ensuring IC packages are designed with sufficient power while increasing density of a board is a tricky problem. There are clever ways to design systems however they might not always work. Designing with special materials gives designers new variables to consider when designing systems with stringent power delivery needs.
Embedded Planar Capacitance
Next generation Planar embedded capacitance power delivery with thinner dielectrics for lower inductance and better power delivery performance.
Planar Embedded Capacitance power delivery material for electrically demanding boards.
Designed for high thermal reliability with excellent CAF resistance. Applications include: automotive, power system, server, and heavy copper PCB.
High Tg / High Reliability / Halogen Free.
Applicable IPC Slash Sheets: IPC-4101 /127, /128, /130; IPC-4103 /250, /550.
Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.
High Tg / Very Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC-4103 /240, /540.
High reliability electrodeposited copper foil available in thicknesses up to 6 oz. (8.4 mils or 210 microns). Typically in stock up to 4 oz, thicker coppers can be used for high power applications.
Also known as Rolled Annealed foil is generally stocked up to 3 oz (105 microns) thick. Rolled foil can be made in much higher thicknesses, up to 400 microns.
Saint-Gobain Chemfilm® is lightweight, flexible polyimide film that has excellent heat and chemical resistant properties. Polyimide films are great dielectrics even at elevated temperatures.