CAC

A bonded Aluminum product in Top and Bottom and or middle configuration, with a single layer of your desired copper foil bonded to the aluminum carrier.

  • Improved panel flatness  – Aluminum CTE is greater than Copper and prepreg resins ensuring a wrinkle free surface
  • Achieve Layup Efficiency –  No separators to clean resurface or polish which are labor intensive & costly
  • Increase quality assurance –  Image impressions & FOD concerns minimized with all 4 edges being bonded
  • Production Efficiency  – Gained by reducing the overall book mass to heat AND cool in a cycle
  • Technical enabler – Supporting thin & low-profile Copper foils from 6 µm > with a VLP2 or IPC A profile

With CAC Layup

Without CAC Layup

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CSC

A bonded Steel product in Top and Bottom and or middle configuration, with a single layer of your chosen copper foil bonded to the steel carrier.

  • 8 mil steel >2x as effective than 15 mil alum in Image transfer reduction / elimination
  • Reduce lamination press mass by using CSC, improving heat RoR & Cool down efficiency  
  • Increased throughput with CSC 8 mil middles, 7.5 times thinner than conventional separators
  • Technical enabler – Supporting thin & low-profile Cu foils from 6 µm > with a VLP2 or IPC A profile
  • Layup Efficiency – No separators to clean resurface or polish –  labor intensive & costly and source of FOD