COPPER Foil
Insulectro stocks, distributes and supports Copper Foil for Rigid, Rigid-Flex and Flex designs.
About COPPER FOIL
Insulectro offers Copper Foils from several world-class manufacturers, Denkai America Electrodeposited foils, JX Nippon Mining & Metals Corp Electrodeposited and Wrought Foils, Mitsui Kinzoku Electrodeposited foils, and Wieland Wrought foils. These foils are engineered to support the conventional and application-specific design PCB, with design attributes for superior adhesion, signal integrity to meet HSD, HDI, and even MSAP requirements.
Copper Foil 101
A cheat sheet on how to understand the IPC spec, and see your foil in action!
Introduction to copper foil treatment layer chemistry and when As free foils contains 0.05% per REACH is acceptable.
Introduction to the basics of skin effect and the benefits of using very low profile copper Rz 2µm max.
Rigid Circuits
High-temperature stability electrodeposited copper foil for inner and outer layer applications with treatment on the matte side of the foil.
High reliability electrodeposited copper foil for inner and outer layer applications with excellent adhesion to a wide range of resin systems with treatment on the matte side of the foil.
Copper Foil In Action
Introduction to nodulation, VLP2 foils and ultra-thin foils for tighter lines and space designs.
Introduction to the basics of skin effect and the benefits of using very low profile copper Rz 2µm max.
Introduction to copper foil treatment layer chemistry and when As free foils contains 0.05% per REACH is acceptable.
Flex & Rigid-Flex Circuits
Superior adhesion electrodeposited copper foil for outer layer application with excellent adhesion to a wide range of resin systems.
Reverse Treatment
High-temperature stability, reverse treat electrodeposited copper foil for inner layer application compatible with high-temperature lamination, and excellent adhesion benefits with treatment on the drum or shiny side of the foil.
JX Nippon Mining JXEFL
Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.
Flexible Circuits
Denkai America TOC-HD
High-flex electrodeposited copper foil for flex to install PCB application with treatment on the matte side of the foil.
Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic-free with zinc treatment properties.
Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.
Very low-profile, rolled-wrought, low-temperature annealable foil with excellent dynamic and static flex properties due to enlarged grain structure and orientation. Suitable for Flexible and Rigid-Flex PCB applications.
Mitsui 3EC-M3-VLP
Low-profile, high tensile strength electrodeposited copper foil, suitable for fine etching in the subtractive process. Used to support semiconductor packages, HDI, and Flexible PCB. With treatment on the matte side of the foil.
Very low profile, annealed-wrought foil suitable for flexible PCB applications. Available in single or double treated finishes.
MSAP (Tighter Line Spaces)
MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 35/35 or less.
MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 20/20 or less.
Arsenic-Free Coppers
Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.
Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.