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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
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COPPER Foil

Insulectro stocks, distributes and supports Copper Foil for Rigid, Rigid-Flex and Flex designs.

About COPPER FOIL

Insulectro offers Copper Foils from several world-class manufacturers, Denkai America Electrodeposited foils, JX Nippon Mining & Metals Corp Electrodeposited and Wrought Foils, Mitsui Kinzoku Electrodeposited foils, and Wieland Wrought foils. These foils are engineered to support the conventional and application-specific design PCB, with design attributes for superior adhesion, signal integrity to meet HSD, HDI, and even MSAP requirements. 


Copper Foil 101:
  • Education & Resource Documents

Product Lines:
  • Rigid Circuits
  • Flex & Rigid-Flex Circuits
  • Reverse Treatment
  • Flexible Circuits
  • MSAP (Tighter Lines & Spaces)
  • Arsenic-Free Coppers

Copper Foil 101

Copper Foil Fact Sheet

Introduction to the Copper Foil basics.

Details
IPC 4562A Decipher

A cheat sheet on how to understand the IPC spec, and see your foil in action!

Details
Arsenic-Free Copper

Introduction to copper foil treatment layer chemistry and when As free foils contains 0.05% per REACH is acceptable.

Details
Skin Effect & Cooper Foil Profiles

Introduction to the basics of skin effect and the benefits of using very low profile copper Rz 2µm max.

Read Whitepaper

Rigid Circuits

Denkai America MHT

High-temperature stability electrodeposited copper foil for inner and outer layer applications with treatment on the matte side of the foil.

Product Details
Denkai America TOBIII

High reliability electrodeposited copper foil for inner and outer layer applications with excellent adhesion to a wide range of resin systems with treatment on the matte side of the foil.

Product Details

Copper Foil In Action

A Technology Enabler

Introduction to nodulation, VLP2 foils and ultra-thin foils for tighter lines and space designs.

Details
Skin Effect & Cooper Foil Profiles Whitepaper

Introduction to the basics of skin effect and the benefits of using very low profile copper Rz 2µm max.

Details
Arsenic-Free Copper

Introduction to copper foil treatment layer chemistry and when As free foils contains 0.05% per REACH is acceptable.

Details

Flex & Rigid-Flex Circuits

Denkai America HP2

Superior adhesion electrodeposited copper foil for outer layer application with excellent adhesion to a wide range of resin systems.

Product Details

Reverse Treatment

Denkai America MLS-MHT

High-temperature stability, reverse treat electrodeposited copper foil for inner layer application compatible with high-temperature lamination, and excellent adhesion benefits with treatment on the drum or shiny side of the foil. 

Product Details

JX Nippon Mining JXEFL

Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.

Product Details

Flexible Circuits


Denkai America TOC-HD

High-flex electrodeposited copper foil for flex to install PCB application with treatment on the matte side of the foil.                                                                                                                                              

Product Details
JX Nippon Mining and Metals JTCLC

Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic-free with zinc treatment properties.                                                    

Product Details
JX Nippon Mining and Metals JTCS-P1

Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.                                                                                                               

Product Details
JX Nippon Mining and Metals HA-V2

Very low-profile, rolled-wrought, low-temperature annealable foil with excellent dynamic and static flex properties due to enlarged grain structure and orientation. Suitable for Flexible and Rigid-Flex PCB applications.

Product Details

Mitsui 3EC-M3-VLP

Low-profile, high tensile strength electrodeposited copper foil, suitable for fine etching in the subtractive process. Used to support semiconductor packages, HDI, and Flexible PCB. With treatment on the matte side of the foil.

Product Details
Wieland Wrought Foil

Very low profile, annealed-wrought foil suitable for flexible PCB applications. Available in single or double treated finishes.                                                 

Product Details

MSAP (Tighter Line Spaces)

Mitsui Kinzoku MT18Ex

MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 35/35 or less.                                                               

Product Details
Mitsui Kinzoku MT18FL

MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 20/20 or less.                                                               

Product Details

Arsenic-Free Coppers

JX Nippon Mining JXEFL

Reverse treat electrodeposited copper foil for inner layer application with a very low profile for HDI and RF demands with treatment on the drum or shiny side of the foil.                                                              

Product Details
JX Nippon Mining and Metals JTCS-P1

Very low-profile electrodeposited copper foil for inner layer application with treatment on the matte side of the foil. Arsenic & cyanide-free with low zinc treatment properties.                                              

Product Details
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