We enable our customers to build better circuits, faster.
Best-in-class products from world-class suppliers at 11 convenient stocking locations.
Industry innovations and key insights direct from the experts.
Supplies and Support
The most advanced materials for fabricators who demand speed and technology.
IPC APEX EXPO 2023
It's a wrap! Our team of experts represented all brands with the latest technology and education at the most significant event in North America for the electronics manufacturing industry.
Top Insulectro Salesperson Clocks 50 Years
Steve Piatt Achieves Half Century of Sales Excellence
We play a vital role in the design and manufacture of future circuits.
For decades, Insulectro has set the pace for the continually evolving high tech electronics business. We learned to stock critical PCB materials close to clients.
PumaFast™ Nationwide Availability
With 11 stocking locations nationwide, we learned to stock critical PCB materials close to clients in order to offer the industry’s fastest delivery.
Insulectro by the numbers
Weekly insights about PCB design and manufacturing.
Why is Pacothane® PACOFLEX™ 10000 the Industry Standard for Flexible Coverlay Applications? We PAC all of these beneﬁts into one product. The incredible PACOFLEX™ 10000. . .
ELIMINATES all Entrapped Air between the Cover-Layer and the Circuit Image on the Base Laminate!
DELIVERS discreet hydraulic force to drive the Coverlay for discrete side-wall conformance with the Circuit Image on the Base Laminate.
LOCKS-IN around the Flexible components to minimize distortion eﬀects caused by Heat and Pressure.
CONFORMS closely to the part surface without excessive ﬂow-out around features.
EQUALIZES Z-axis pressure when used PACOPADS® Pressure Diﬀuser Pads.
For next-gen Ultra High Density Interconnect manufacturing. DuPont’s metallization supports fabricators jumping into the unknown.
DESMEARING: BT or other build up ﬁlms require special treatment, DuPont’s Circuposit products are formulated speciﬁcally for adhesion.
METALLIZATION: Circuposit™ electroless metallization is formulated to work with either MSAP or SAP build up methodology. Millions of square feet processed yearly and reliably.
ELECTROLYTIC PLATING: Conquer the mix of Vias, Copper Pillaring, Redistribution Layer plating (RDL with Copper Gleam™ plating solutions.
Imaging: Riston®, DuPont’s dry ﬁlm solutions for down to 5µ lines, are mSAP ﬁlms imaged with PCB equipment.
Interconection: DuPont's entire portfolio of next generation UHDI products are proﬁled, under one supplier roof, to make it easier to bring your capabilities to the next level.
“…Insulectro… has done the best merge on PCB Manufacturing and Printed Electronics Manufacturing. They’re a staple in the printed electronics world.”
Vice President & Managing Partner