Insulectro & DuPont™ Leadership Talk Tech & Flex at The Silicon Valley Tech Center

September. 2022 (Sunnyvale, CA.)

The Insulectro Team recently met with DuPont’s leadership at their Silicon Valley Technology Center (SVTC) in Sunnyvale, California.

Located in the San Francisco Bay Area, the SVTC contains state-of-the-art applied engineering labs and an innovation center. The center’s purpose is to engage new and existing customers, engineers, startups, partners, and the venture capital community.

The meeting was filled with discussion of the various interactive touchscreen displays, prototypes, and cutting-edge equipment that demonstrates DuPont’s journey from raw materials to finished products. Erik Koepf, Ph.D., R&D Technical Manager for the SVTC, provided an in-depth tour of the ten on-site labs.

The lab has recently undergone an expansion that includes a Class 100 Cleanroom and spaces that emphasize flex circuitry testing, prep, lamination, inspection, reliability via heat, humidity, pressure, stretch, bend, and optical and non-contact measurement.

Click the link to review our latest Flexible Circuitry offerings, including Pyralux® and Kapton®, the go-to materials for the highest in design reliability.  Flexible Circuitry – Insulectro                

Geoffrey Leeds, (Flex Product Manager) is your Insulectro resource to schedule a visit to DuPont’s Silicon Valley Tech Center and answer ANY technical support inquiries: [email protected]


Insulectro & DuPont™ MCM Exhibit at SEMICON WEST/FLEX in San Francisco


Insulectro & DuPont™ MCM Exhibit at SEMICON WEST/FLEX in San Francisco

July. 2022 (San Francisco, CA.)

Insulectro Printed Electronics partnered with DuPont™ Microcircuit and Component Materials (MCM) division to exhibit at SEMICON WEST at the Moscone Center in San Francisco, July 12-14. The show is co-located with FLEX. Exhibit space was #2450.

SEMICON WEST is the flagship annual event for the global microelectronics industry. It is the premier event for the display of new products and technologies for microelectronics design and manufacturing, featuring technologies from across the microelectronics supply chain, from electronic design automation to device fabrication (wafer processing), to final manufacturing (assembly, packaging, and test). More than semiconductors, SEMICON West also showcased emerging markets and technologies born from the microelectronics industry, including micro-electromechanical systems (MEMS), photovoltaics (PV), flexible electronics and displays, nano-electronics, solid-state lighting (LEDs), and related technologies.

FLEX, the Flexible Hybrid Electronics (FHE) go-to event is the center of technical and informative demonstration of flexible hybrid and printed electronics products, equipment, processes & materials, and the applications they enable. The FLEX Conference features the latest advances in flexible and printed electronics, including applications that deepen interactions between users and their surroundings. FLEX is the annual touchpoint centered around flexible hybrid, printed electronics products, equipment, processes, and materials, emphasizing the latest technical breakthroughs, unique electronics applications, and business strategies.


The first PCEA Orange County chapter "Lunch 'n Learn" in 2.5 years was a success!

July. 2022 (Santa Ana, CA.)

On July 26th, Insulectro sponsored the first in-person PCEA (Printed Circuit Engineering Association) “Lunch ‘n Learn” in 2.5 years! Attendees met and learned from our expert team on the following agenda:

Topic #1: Signal Integrity Applications in Layout
Speaker: Mike Creeden, CID+, Master Inst. PCE-Edu Technical Director Design Education

Applying SI theory to your layout, covering EM fields, laminates, copper profile, uninterrupted GND return Path, impedance discontinuities from your routing, and proper shielding.

Topic #2: Advanced Via Solutions using Ormet® Pastes
Speaker: Chris Hunrath Vice President of Technology

The latest on Z-Axis Interconnects for Multi-lam HDI, Back-drill elimination, solving high aspect ratio plating on high layer count boards, and any-layer-via usage.

Topic #3: Overcoming Flex Design Challenges
Speaker: Geoffrey Leeds, CID Flex Product Manager

Learn how to overcome Flex Design challenges by understanding the Building Blocks; pitfalls to avoid during layout; Dynamic vs. Static design constraints; and the proper materials and their applications.

The Printed Circuit Board Association of America is a consortium of companies, representatives, and enthusiasts who support initiatives to advance the U.S. domestic production of microelectronics and specifically printed circuit boards.

Join for free: PCEA Membership – Printed Circuit Engineering Association


The RF/Microwave industry’s largest annual exhibition and symposium makes a “face-to-face” comeback!

June. 2022 (Denver, CO.)

Insulectro and the Isola Group teamed up to welcome visitors at the 2022 IEEE International Microwave Symposium (IMS2022) Exhibition in Denver, Colorado.

A main draw for the show was the innovative demonstrations and education. Detailed data and free guidance on how to trim loss, size, and weight from their high-speed, high-frequency PCBs using Isola’s advanced circuit materials. These include materials carefully formulated for low loss in RF/microwave and millimeter-wave (mmWave) circuits to 110 GHz and beyond and excellent signal integrity (SI) in high-speed-digital (HSD) circuits well into the Gb/s speed range. 

Over 400 companies exhibited in Denver’s Colorado Convention Center.

Check out the recap video below:



Popular Del Mar Electronics Show Returns After Two Years Bigger than Ever

May. 2022 (Del Mar, CA.)

After a two-year hiatus due the pandemic, the Del Mar Electronics and Manufacturing Show was back in full vigor at the Del Mar Fairgrounds (CA) on May 4 and 5, 2022. The show, which is an industry favorite, featured exhibitions from fabricators, suppliers, OEMs, as well as a host of other exhibitors from adjacent markets to printed circuit board manufacturing. Insulectro was joined in a dynamic coalition of three booths with DuPont MCM and Isola Group flanking it. The show was well attended and universal reaction was how good it was to meet again – face to face. Insulectro’s focus, in addition to its best-in-class product array, was ensuring that the best products are properly used to achieve maximum results – a theme which has been well received.

      


Back after 2 Years & Stronger than Ever 2022 IPC APEX EXPO ROCKS IT!

Feb. 2022 (San Diego, CA.)

From revolutionary innovations displayed on the show floor to expert insights conveyed in technical conference sessions, professional development courses and standards development committee meetings, IPC APEX EXPO 2022 provided the education and networking connections that helped 3,647 visitors address today’s business challenges and prepare for their factories of future.  

Insulectro and booth mates Isola, DuPont, InduBond® (and our other suppliers/partners) discovered the benefits of having more time to spend with attendees.
      
To bring the key learnings and interests of IPC directly to you, we crafted 45-minute presentation sessions called the IPC6Pack! – Virtual or live, presented by our subject matter experts, to share with you or your team our key findings of what’s new, what’s interesting, and what’s coming.



BIG WEEK FOR EQUIPMENT MANUFACTURER INDUBOND®

On Tuesday, November 16, Productronica 2021 in Munich, Germany, opened its doors to an eager audience looking for some sense of normality at the continent’s biggest electronics exhibition. InduBond® was in the thick of things showing their new double-entry X-Press 360, which uses a revolutionary new way of laminating PCBs. The press uses induction heating technology to deliver precisely the energy needed to cure the resins with no thermal delays in any direction of the stack – X, Y, and Z direction.

The press was shown with a proprietary stack-up from Insulectro named CSC (copper-steel-copper.)

InduBond® was also in the news with photographs of its massive expansion at its Barcelona HQ. The expansion will help increase capacity to match the demand this system is causing.

Lastly, InduBond’s® North American distributor, Insulectro, has announced its first sale of the X-Press 360 system to premiere fabricator APCT in Southern California – a harbinger of what’s to come as the NA PCB market becomes aware of the unique capabilities of InduBond® and its lamination and automation equipment.

InduBond's® massive expansion at its Barcelona HQ. The expansion will help increase capacity to match the demand this system is causing.



Insulectro, Isola, & DuPont™ Create Superbooth During 2020 IPC Apex Expo

Feb. 2020 (San Diego, CA.)

On the exhibition floor, at San Diego Convention Center, Insulectro again partnered with suppliers Isola and DuPont to create a superbooth, the largest in the materials section at 1800 square feet.

Prominently featured demonstrations on products manufactured by DuPont, Isola, LCOA, Pacothane, Denkai America, Focus Tech, Ormet Circuits, and CAC generated huge interest in applications for high speed digital, RF/microwave, drill room efficiency, and printed electronics.

A record number of attendees stopped by our exhibit booth to touch and feel the materials and to view DuPont’s PowerChats™ where new technology topics – Highly Reliable Laminates, 5G, and Harsh Environment Automotive materials were presented in 13.5 minute talks.

July. 2022 (Santa Ana, CA.)

On July 26th, Insulectro sponsored the first in-person PCEA (Printed Circuit Engineering Association) “Lunch ‘n Learn” in 2.5 years! Attendees met and learned from our expert team on the following agenda:

Topic #1: Signal Integrity Applications in Layout
Speaker: Mike Creeden, CID+, Master Inst. PCE-Edu Technical Director Design Education

Applying SI theory to your layout, covering EM fields, laminates, copper profile, uninterrupted GND return Path, impedance discontinuities from your routing, and proper shielding.

Topic #2: Advanced Via Solutions using Ormet® Pastes
Speaker: Chris Hunrath Vice President of Technology

The latest on Z-Axis Interconnects for Multi-lam HDI, Back-drill elimination, solving high aspect ratio plating on high layer count boards, and any-layer-via usage.

Topic #3: Overcoming Flex Design Challenges
Speaker: Geoffrey Leeds, CID Flex Product Manager

Learn how to overcome Flex Design challenges by understanding the Building Blocks; pitfalls to avoid during layout; Dynamic vs. Static design constraints; and the proper materials and their applications.

The Printed Circuit Board Association of America is a consortium of companies, representatives, and enthusiasts who support initiatives to advance the U.S. domestic production of microelectronics and specifically printed circuit boards.

Join for free: PCEA Membership – Printed Circuit Engineering Association