Insulectro stocks, distributes and supports Copper Clad Laminate systems for both flexible and rigid PCB manufactures.
Insulectro offers laminates from two world-class manufactures, Isola® Rigid Laminates/Prepregs and DuPont™ Pyralux® Flexible Copper Clad Laminates. Both Isola® and DuPont materials are qualified for highly reliable applications like spaceborne satellites, oil and gas down well applications, or underhood automotive environments. The product offerings also include materials for any consumer application. Isola’s FR4 resin-based systems are inherently well suited for high fabricator yields, and DuPont’s FCCL’s are the industry standard.
PumaFast™ materials are readily in stock and available for immediate delivery. Standard Materials are popular laminates we distribute and most likely in stock.
Advanced converting equipment provides customers with the ability to have a wide variety of plastic and polymer material processed from large rolls of raw material into smaller rolls or tapes of varying length depending on customer specification allows the customer to obtain materials in optimum widths and lengths for the processing equipment.
DFM when performed correctly from the start will ensure that our products meet their intended goals with high-producibility which enables higher yields and lower costs for our production built products. When done properly high quality and long term reliability built-in also ensure continued market acceptance.
Insulectro offers free design reviews with some limitations to help ensure a correct by construction stackup, that supports robust DFM and signal integrity performance.
DuPont™ Flexible Laminates
High reliability Standard Flexible laminate with broadest construction offerings.
Consumer grade flexible laminates with limited construction offerings.
RF and MW capable flexible laminate.
Single sided Flexible Copper Clad Laminate.
Pyralux® FR is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates that is UL V-0 certified.
Pyralux® LF is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates.
Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225 C.
Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.
A unique Copper Clad laminate treated with Nickle Chrome to allow for embedded resistance designs.
Embedded capacitance material for rigid PCB applications with energy demanding HDI designs.
Isola® Rigid Laminates
High resin content laminate designed for Ultra Low Loss RF/MW designs.
High glass content laminates for Ultra Low Loss RF/MW designs.
Very Low loss Laminate alternative to PTFE.
Halogen-free, Very Low Loss Laminate and Prepreg.
Mid-Dk with exceptional low loss performance for HSD designs.
Low Loss laminate of choice for HSD designs.
Halogen-free Low loss Laminate.
A flame resistant, polyimide resin system suitable for military, commercial or industrial electronic applications.
Polyimide UL laminate.
Polyimide No Flow Specialty PrePreg.
No-flow and low-flow prepregs specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
Lead free Mid loss laminate.
Industry Leading Standard loss FR Laminate.
Standard FR4 Laminate.
DuPont's premiere partnership laborator for OEM collaboration
Isola's R&D Facility to collaborate with OEM's on emerging technologies
(PCEA®) is an international network of engineers, designers, fabricators, assemblers, and anyone related to printed circuit development.
A technical collaboration between our customers Engineering, Field Applications or Sales team with Insulectro's technical resources.