Laminates
Insulectro stocks, distributes and supports Copper Clad Laminate systems for both flexible and rigid PCB manufactures.
About Laminates
Insulectro offers laminates from world-class manufacturers, Arlon and EMC Laminates and Prepregs, along with DuPont™ Pyralux® Flexible Copper Clad Laminates. Both Arlon and DuPont materials are qualified for high-reliability applications like spaceborne satellites, surgical/medical, oil, and gas down well applications, or under hood automotive environments. The product offerings also include materials for any consumer application. Arlon’s FR4 resin-based systems are inherently well suited for high fabricator yields, and DuPont’s FCCL’s are the industry standard.
custom services
PumaFast™ materials are readily in stock and available for immediate delivery. Standard Materials are popular laminates we distribute and most likely in stock.
Advanced converting equipment provides customers with the ability to have a wide variety of plastic and polymer material processed from large rolls of raw material into smaller rolls or tapes of varying length depending on customer specification allows the customer to obtain materials in optimum widths and lengths for the processing equipment.
DFM when performed correctly from the start will ensure that our products meet their intended goals with high-producibility which enables higher yields and lower costs for our production built products. When done properly high quality and long term reliability built-in also ensure continued market acceptance.
Insulectro offers free design reviews with some limitations to help ensure a correct by construction stackup, that supports robust DFM and signal integrity performance.
DuPont™ Flexible Laminates
High reliability Standard Flexible laminate with broadest construction offerings.
Consumer grade flexible laminates with limited construction offerings.
Pyralux® FR is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates that is UL V-0 certified.
Pyralux® LF is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates.
Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225°C.
Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.
A unique Copper Clad laminate treated with Nickle Chrome to allow for embedded resistance designs.
Embedded capacitance material for rigid PCB applications with energy demanding HDI designs.
Rigid Laminates
Arlon’s 85N is a 250⁰C high glass transition pure polyimide resin system that provides superior thermal resistance to high-temperature end-use electronics. Coupled with the high-temperature stability and the pure resin formulation, 85N is the best choice for high-layer count multilayers with long service life for aerospace, military, space, and other applications where reliable thermal stability is required.
Meets requirements of IPC-4101/40 and IPC-4101/41.
Arlon’s 85HP is the best-in-class 250⁰C high glass transition temperature polyimide resin system available on the market today. This unique blend of polyimide resin and micro-fine proprietary fillers results in superior performance for the most demanding thermal and high-layer applications. Applications for 85HP include mission critical PWB’s for military, aerospace, space, down hole oil and gas drilling and many other high reliability applications.
Validated to three IPC-4101 slash sheets 40, 41, & 43.
Arlon’s 86HP is a revolutionary addition to Arlon’s best-in-class high performance polyimide laminate systems engineered to meet high temperature, electrical, and mechanical performance not found with any other polyimide resin system. 86HP applications include mission-critical PWB’s for military, aerospace, space, down hole oil and gas drilling, burn-in, and automatic test equipment.
86HP meets IPC-4101 slash sheets 40, 41, and 43.
Arlon’s 37N is a 200⁰C glass transition temperature polyimide low-flow resin system designed for bonding multilayer rigid flex, heat sink attachment to MLB’s or other applications where minimal and uniform resin flow is required. 37N can be cured as low as 350⁰F and has excellent thermal stability. Applications include military, aerospace, space, commercial, and industrial PWB electronics.
Meets requirements of IPC-4101/42.
Arlon’s 38N is the second-generation 200⁰C glass transition temperature polyimide low-flow resin system which is designed to improve adhesion and bond strength to Kapton® polyimide films, copper and other metals. Applications include military, aerospace, space, commercial and industrial PWB electronics.
Meets requirements of IPC-4101/42.
Arlon’s 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heat-sinks to multilayer epoxy PCBs. With a high glass transition temperature of 170⁰C, the prepreg can be used in high-performance or high-temperature applications compared to a standard difunctional epoxy low-flow. 49N is well suited for high-layer count rigid-flex applications where z-axis expansion is a concern.
Meets requirements of IPC-4101/26.
Arlon’s 51N is a non-DICY multifunctional epoxy low-flow prepreg system designed to provide high reliability through lead-free solder operations. The high decomposition temperature and high thermal stability of this material is ideal for use in complex rigid-flex fabrication and assembly operations where minimum resin flow is required.
Meets requirements of IPC-4101/126.
Designed for high thermal reliability with excellent CAF resistance. Applications include: automotive, server, computer, and consumer electronics.
High Tg / CAF Resistance / Lead Free.
Applicable IPC Slash Sheets: IPC-4101 /98, /99, /101, /126; IPC-4103 /250, /550.
Designed for high thermal reliability with excellent CAF resistance. Applications include: automotive, power system, server, and heavy copper PCB.
High Tg / High Reliability / Halogen Free.
Applicable IPC Slash Sheets: IPC-4101 /127, /128, /130; IPC-4103 /250, /550.
Designed for high thermal reliability with excellent CAF resistance. Applications include: automotive, power system, server, and heavy copper PCB.
High Tg / High Reliability / Halogenated.
Lowest Z Axis CTE delivering greater via reliability of any FR4 offering. CTE: 1.8% (50~260°C)
Applicable IPC Slash Sheets: IPC-4101/98, /99, /101, and /126; IPC-4103 /250, /550.
Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.
High Tg / Very Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC-4103 /240, /540.
Designed for high thermal reliability with excellent CAF resistance. Applications include: high-speed Ethernet, network, HPC, AI, 5G, and antenna.
High Tg / Ultra Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC 4101 /134; IPC-4103 /230, /530.
EM-892K is a next generation, halogen-free, high Tg laminate, designed for high speed digital and RF applications. Applications include: high-speed Ethernet, network, HPC, AI, 5G, and antenna.
High Tg / Extreme Low Loss / Halogen Free
Applicable IPC Slash Sheets: IPC-4101 /134; IPC-4103 /230, /530
OEM Collaboration
DuPont's premiere partnership laborator for OEM collaboration
(PCEA®) is an international network of engineers, designers, fabricators, assemblers, and anyone related to printed circuit development.
A technical collaboration between our customers Engineering, Field Applications or Sales team with Insulectro's technical resources.