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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact

suppliers

SHIKOKU

About SHIKOKU

Shikoku Chemicals Corporation manufactures and sells chemical products and housing materials in Japan and internationally. Its product portfolio includes inorganic chemicals, organic chemicals, advanced and specialty chemicals, electronic chemicals comprising organic solderability preservative and microetching solutions, and advanced and specialty chemicals.

OSP (Organic Solderability Preservative) is the most popular final surface finish for PCBs. OSP film has excellent humidity resistance to protect copper oxidation.

Organic Solderability Preservatives

Glicoat-SMD F2(LX)

Best-in-Class OSP coating.

 

Advanced Pretreatments

Glibrite GB-4300

Proprietary peroxide/sulfuric micro etch. Engineered to maximize soldermask and dryfilm adhesion.

Glicap GC-750

Non-etching oxide alternative. Engineered for High Speed Digital and RF applications.                           

Corporate Headquarters

Insulectro
20362 Windrow Drive
Lake Forest, CA 92630
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Call (949) 587-3200

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