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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact

suppliers

Mitsui Kinzoku

About Mitsui Kinzoku

Promising Material.

Intelligence.

Material Intelligence.

Copper foil acts as the essential electronic materials nowadays. In order to strengthen the quality and trust from customers, Mitsui Kinzoku will continue to accumulate and utilize the “Material Intelligence” in the future.

Mitsui Logo 3

MSAP

Mitsui Kinzoku MT18Ex

MicroThin is an ultra thin foil on a 18µm  carrier foil to support very fine pitch patterns.            Target L/S = 35/35 or less.

Product Details
Mitsui Kinzoku MT18FL

MicroThin is an ultra thin foil on a 18µm  carrier foil to support very fine pitch patterns.                    Target L/S = 20/20 or less.  

Product Details
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