Insulectro, the largest distributor of Flexible substrates for the North American market, proudly distributes DuPont’s complete line of Pyralux® goods.
About Flexible circuitry
Pyralux® materials are the industry standard for fabricating simple single-sided flex to complex multi-layer rigid boards. DuPont’s proprietary formulations of polyimides (Kapton®) have no equal.
From high-reliability designs to simple consumer goods, Pyralux® materials are every designer’s go-to.
Qualified and proven for all high-reliability market places such as Space, under hood or medical applications for over 30 years.
A more commercially friendly material with unmatched dynamic bending performance.
UL 94 VTM-0 certified acrylic adhesive for flexible designs.
The original flexible adhesive. Ideal for its high reliability in commercial design applications.
An innovative low loss adhesive for high speed flex designs.
Specialty & Rigid Flex Products
A unique Copper Clad laminate treated with Nickle Chrome to allow for embedded resistance designs.
A clad and bondply material constructed with FEP layers to minimize loss for RF based designs.
The adhesive of choice for any High Temperature operation with an MOT of 225C.
The FR406N family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
The P25N® product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications such as Flexible circuits and Heat Sink bonding.
Ultra-Low Profile Treatment Electro Deposited copper foil with very good ductility for flex applications.
Electro Deposited copper foil with very good ductility for flex applications.
Also known as Rolled Annealed foil is the first choice for flex applications.