HIGH-SPEED DIGITAL
A successful high-speed digital product is reliant upon the PCB material selected. Several factors, such as the maximum data rate, the length of the high-speed digital channel, as well as thermal and processing considerations should be taken into account when choosing a material.
About HIGH-SPEED DIGITAL
Our High-speed Digital materials deliver superior performance and CAF resistance. These low-loss materials are targeted for applications that require high reliability and signal integrity.
custom services
- PumaFast™
- Rewinding Services
- Manufacturing Technical Support
- Designer Support
Oxide
Non-etching oxide alternative. Engineered for High Speed Digital and RF applications.
Rigid Laminates
Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.
High Tg / Very Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC-4103 /240, /540.
Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.
High Tg / Ultra Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC-4103 /240, /540.
Designed for high thermal reliability with excellent CAF resistance. Applications include: high-speed Ethernet, network, HPC, AI, 5G, and antenna.
High Tg / Ultra Low Loss / Halogen Free.
Applicable IPC Slash Sheets: IPC 4101 /134; IPC-4103 /230, /530.
Ormet® Sintering Paste
Patented, lead-free, TLPS sintering paste designed to create innerconnects in a PCB or to combine PCBs
Patented, lead-free, TLPS sintering paste designed to create innerconnects in a PCB or to combine PCBs with a slightly higher metal loading than 701 or better thermal and electrical properties.
Flexible Laminates
Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225 C.
Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.
Copper Foils
Ultra-Low Profile treatment with good bonding characteristics for lower signal loss on high speed designs.
Also known as Rolled Annealed foil. This is a popular choice for high speed applications due to its structure and low profile treatment. It’s available as a loose foil for both sub and outerlayer applications.