Description

Key Properties

  •  Excellent heat-resistance to stand multiple heat cycles

  •  No deposit on gold surface, only on copper.

  • Excellent compatibility with non-clean soldering fluxes and solder pastes to achieve satisfactory solderability in plated through-holes and spreadability on SMT pads even after multiple heat cycles.

  • Excellent humidity resistance to prevent copper oxidation.

  • Non-sticky, thin and uniform coating on copper basically

Documentation

Tools