Shikoku Glicoat® SMD F2LX
Glicoat®-SMD F2(LX) forms uniform, very thin and transparent organic coating on copper surface like other Glicoat® products, even in via-holes by chemical reaction between the active ingredient, substituted imidazole derivatives, and copper.
Excellent heat-resistance to stand multiple heat cycles
No deposit on gold surface, only on copper.
Excellent compatibility with non-clean soldering fluxes and solder pastes to achieve satisfactory solderability in plated through-holes and spreadability on SMT pads even after multiple heat cycles.
Excellent humidity resistance to prevent copper oxidation.
Non-sticky, thin and uniform coating on copper basically