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Gain free access to a variety of Insulectro research, webinars and more. Below are examples of what you’ll find upon accessing the registered content.

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Recent Whitepapers

Detailing our latest findings and innovation.

Advanced Via Solutions (Part 1/3)

Author: Michael Creeden CID+ Technical Director Design Education

Advanced circuit requirements are presenting new challenges every year. These challenges are driven by the ever-increasing need to be smaller, faster, accomplish more, be cheaper, and often must be accomplished quicker. So, each year we try to meet these needs by working smarter, faster, more efficiently, adding technology and innovation. One of the most challenging features on our circuit boards are the vias by which we make Z interconnects…

OEM FORUM Virtual Power Chats™

Virtual power chats with industry guests and Insulectro experts.

The Heat is On!

Finding PCB Materials That Like It Hot

Insulectro's Ron Murdock and Chris Hunrath are joined by Isola IS550H experts Steven Sekanina and Michael Gay.

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Unwrinkling Foil Profiles

Doom Your Board with Wrong Foil

Join host Ron Murdock with Insulectro Copper Foil Product Manager Mark Satchwell and Tech VP Chris Hunrath CID+.

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Power of 5

Five things you should know about PCB design and manufacturing. New insights added weekly.

HSD: ISOLA Warp Speed Laminates

Mechanically spread reinforcement for best CAF and SI performance
Very low profile coppers for best in class insertion loss performance
Full product offering to match your specific design requirements: I-Speed® (DK=k 3.64/Df .006), I-Tera® MT40 (Dk 3.45/Df.0031), Tachyon® 100G (Dk 3.02/Df .0021)
Domestically produced in new Chandler, AZ QT facility
Extensive inventory position in Insulectro distribution centers.

The Most Advanced Substrates You Could Use

Advanced Substrates: full compliment of available substrates to meet your requirements
Local inventory availability: PET, FEP, PFA, PTFE, TPU, Release Liners, Tedlar, Kapton & Release films
Converting Capabilities: custom slitting, rewind, sheeting, tooling & packaging available
Delivery: 48 hours, 24 hours and same day service on rolls and panels
In-house technical support and product selection

Glossary of Industry Terms

A comprehensive list of key technical terms and definitions.

* Represents New Advanced Packaging Terms

*µBumps: Smaller copper pillars.

*300mm Bumping: Copper pillar plating across a whole 300 mm wafer.

*Advanced Packaging: Next generation of Packaging. Akin to HDI for PCB’s.

*AMARO: Automated Microelectronics Analysis and Reporting.

Annular Ring: This term refers to the copper pad area that is left after a hole is drilled through it. This ring is measured from the edge of the pad to the edge of the hole and is an important consideration in PCB design, as it allows an electrical connection to be made from one side of the hole to the other.

Anti-Solder Ball: This type of technology is commonly applied in SMT production lines with the goal of limiting the amount of tin involved in the stencil process. This is done by making a stencil on the board and creating openings at places where the solder ball tends to be produced so that the tin paste will flow to the openings.

AOI: Short for automated optical inspection, AOI refers to a type of inspection method used to find potential problems concerning soldering performance in multi-layer PCBs with components mounted on. The AOI equipment finds these issues by capturing images of the inner PCB surfaces, looking for any possible issues in terms of displacement, polarity etc.

AQL: Short for acceptance quality limit, AQL refers to the acceptable number of defective boards produced within a production run.

...and 140+ more!