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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA®
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD PERFORMANCE MATERIALS
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
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Education

Register to gain access to industry innovations and key insights direct from the experts at Insulectro.

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Gain free access to a variety of Insulectro research, webinars and more. Below are examples of what you’ll find upon accessing the registered content.

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gain access to:
  • OEM Forum Videos
  • Power of 5™
  • Glossary of Industry Terms
  • Whitepapers
  • Additional Video Content

Recent Whitepapers

Detailing our latest findings and innovation.

Signal Integrity (SI), Electro-Magnetic Interference &
Compatibility (EMI/EMC)

Author: Michael Creeden CID+ Technical Director Design Education

Signal Integrity is a process to determine that the signal was delivered properly through a transmission line. Thus, a net could have good signal integrity or bad signal integrity. We must also consider that each net could induce a bad signal integrity phenomena to any adjacent net. This concept can have further-reaching concerns when energy emissions radiate and affect…

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OEM FORUM Virtual Power Chats™

Virtual power chats with industry guests and Insulectro experts.

The Heat is On!
Finding PCB Materials That Like It Hot

Insulectro's Ron Murdock and Chris Hunrath are joined by Isola IS550H experts Steven Sekanina and Michael Gay.

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Unwrinkling Foil Profiles
Doom Your Board with Wrong Foil

Join host Ron Murdock with Insulectro Copper Foil Product Manager Mark Satchwell and Tech VP Chris Hunrath CID+.

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Power of 5

Five things you should know about PCB design and manufacturing. New insights added weekly.

HSD: ISOLA Warp Speed Laminates
  • Mechanically spread reinforcement for best CAF and SI performance

  • Very low profile coppers for best in class insertion loss performance

  • Full product offering to match your specific design requirements: I-Speed® (DK=k 3.64/Df .006), I-Tera® MT40 (Dk 3.45/Df.0031), Tachyon® 100G (Dk 3.02/Df .0021)

  • Domestically produced in new Chandler, AZ QT facility

  • Extensive inventory position in Insulectro distribution centers.

The Most Advanced Substrates You Could Use
  • Advanced Substrates: full compliment of available substrates to meet your requirements

  • Local inventory availability: PET, FEP, PFA, PTFE, TPU, Release Liners, Tedlar, Kapton & Release films

  • Converting Capabilities: custom slitting, rewind, sheeting, tooling & packaging available

  • Delivery: 48 hours, 24 hours and same day service on rolls and panels

  • In-house technical support and product selection

Glossary of Industry Terms

A comprehensive list of key technical terms and definitions.

Active Components: This term refers to a type of component that is dependent on the flow direction of an electrical current. For example, a transistor, rectifier or valve would be considered active.

ALIVH: Short for any layer inner via hole, this is a type of technology used to build multi-layer BUM PCBs. This method uses a solder to create an electrical connection between PCB layers. ALIVH often replaces traditional vias and is a useful production method for creating high-density BUM PCBs.

Analog Circuit: It refers to circuits processing analog signals (continuous and variable signal). The output is non-binary within this type of circuit.

Annular Ring: This term refers to the copper pad area that is left after a hole is drilled through it. This ring is measured from the edge of the pad to the edge of the hole and is an important consideration in PCB design, as it allows an electrical connection to be made from one side of the hole to the other.

Anti-Solder Ball: This type of technology is commonly applied in SMT production lines with the goal of limiting the amount of tin involved in the stencil process. This is done by making a stencil on the board and creating openings at places where the solder ball tends to be produced so that the tin paste will flow to the openings.

AOI: Short for automated optical inspection, AOI refers to a type of inspection method used to find potential problems concerning soldering performance in multi-layer PCBs with components mounted on. The AOI equipment finds these issues by capturing images of the inner PCB surfaces, looking for any possible issues in terms of displacement, polarity etc.

...and 50+ more!

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