Glossary of Industry Terms
A comprehensive list of key technical terms and definitions.
* Represents New Advanced Packaging Terms
*µBumps: Smaller copper pillars.
*300mm Bumping: Copper pillar plating across a whole 300 mm wafer.
*Advanced Packaging: Next generation of Packaging. Akin to HDI for PCB’s.
*AMARO: Automated Microelectronics Analysis and Reporting.
Annular Ring: This term refers to the copper pad area that is left after a hole is drilled through it. This ring is measured from the edge of the pad to the edge of the hole and is an important consideration in PCB design, as it allows an electrical connection to be made from one side of the hole to the other.
Anti-Solder Ball: This type of technology is commonly applied in SMT production lines with the goal of limiting the amount of tin involved in the stencil process. This is done by making a stencil on the board and creating openings at places where the solder ball tends to be produced so that the tin paste will flow to the openings.
AOI: Short for automated optical inspection, AOI refers to a type of inspection method used to find potential problems concerning soldering performance in multi-layer PCBs with components mounted on. The AOI equipment finds these issues by capturing images of the inner PCB surfaces, looking for any possible issues in terms of displacement, polarity etc.
AQL: Short for acceptance quality limit, AQL refers to the acceptable number of defective boards produced within a production run.
...and 140+ more!