About Denkai America
Denkai America is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Denkai America produces both conventional cladding and application specific copper foils required by technology’s leading edge companies.
At Denkai America, copper foils are electroformed on revolving titanium drums, unique for the ability to deposit copper foils with a high-quality surface. Electroformed foils are then subjected to a variety of surface treating operations contingent upon end-use requirements.
High-temperature stability, reverse treat electrodeposited copper foil for inner layer application compatible with high-temperature lamination, and excellent adhesion benefits with treatment on the drum or shiny side of the foil.
Superior adhesion electrodeposited copper foil for outer layer application with excellent adhesion to a wide range of resin systems.
High reliability electrodeposited copper foil for inner and outer layer applications with excellent adhesion to a wide range of resin systems with treatment on the matte side of the foil.
High-temperature stability electrodeposited copper foil for inner and outer layer applications with treatment on the matte side of the foil.