ADDITIVE TECHNOLOGIES
Additive Technology, mSAP (modified semi-additive) is a technology where circuit conductors are "added" rather than etched to make electrical connections.
About ADDITIVE TECHNOLOGIES
Additive circuitry can be formed from plating, powdered metallurgy (pastes), conductive inks and so on. Additive circuit formation can achieve geometries not possible with traditional printing and etching. Additive technology is often used in combination with subtractive technology to form complex circuit structures. This is the basis for modified semi-additive technology/processes. We have imaging, dielectrics, and ultra-thin foil products for the PCB fabricator.
custom services
- PumaFast™
- Rewinding Services
- Manufacturing Technical Support
- Designer Support
Copper Plate
DuPont™ COPPER GLEAM™ 125-EX
Low current density, high aspect ratio; Mid current density, high throughput.
Electroless Copper
DuPont™ CUPOSIT™ 328-L
Low-build tartrate based electroless copper system intended for flash or panel plate acid copper applications.
Direct Metallization
DuPont™ CONDUCTRON™
Palladium-based DM process for through-hole and blind microvia applications.
Direct Image Dry Film Photoresists
RISTON® DI5100 (15, 25 micron)
These are thin resists formulated for sub 25 micron resolution.
Copper
Mitsui MT18Ex
MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 35/35 or less.
Mitsui MT18FL
MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 20/20 or less.