ADDITIVE TECHNOLOGIES

Additive Technology, mSAP (modified semi-additive) is a technology where circuit conductors are "added" rather than etched to make electrical connections.

About ADDITIVE TECHNOLOGIES

Additive circuitry can be formed from plating, powdered metallurgy (pastes), conductive inks and so on. Additive circuit formation can achieve geometries not possible with traditional printing and etching. Additive technology is often used in combination with subtractive technology to form complex circuit structures. This is the basis for modified semi-additive technology/processes. We have imaging, dielectrics, and ultra-thin foil products for the PCB fabricator.

custom services

Copper

Mitsui MT18Ex

MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 35/35 or less.

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Mitsui MT18FL

MicroThin is an ultra-thin foil on an 18µm carrier foil to support very fine pitch patterns. Target L/S = 20/20 or less.

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Resin Systems with ultra-thin options for mSAP & buildup technolgies

EMC EM-370(Z)

Designed for high thermal reliability with excellent CAF resistance. Applications include: automotive, power system, server, and heavy copper PCB.

High Tg / High Reliability / Halogen Free.

Applicable IPC Slash Sheets: IPC-4101 /127, /128, /130; IPC-4103 /250, /550.

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EMC EM-528

Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.

High Tg / Very Low Loss / Halogen Free.

Applicable IPC Slash Sheets: IPC-4103 /240, /540.

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EMC EM-528K

Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom.

High Tg / Ultra Low Loss / Halogen Free.

Applicable IPC Slash Sheets: IPC-4103 /240, /540.

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Direct Image Dry Film Photoresists

Qnity™ RISTON® DI5100 (15, 25 micron)

These are thin resists formulated for sub 25 micron resolution.

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