DuPont™ COPPER GLEAM™ CuPulse
Formulated for PPR plating of high aspect ratio vias, HDI designs and mixed technology features while not compromising productivity. Offers the abiltiy to plate blind vias and high aspect ratio holes with excellent throwing power and surface thickness distribution.
- Excellent throwing power & leveling in low current density areas
- Uniform deposit with excellent physical & thermal properties
- Reduced plating time compared with traditional DC plating
- Full analytical control with conventional CVS techniques