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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact

METALLIZATION

Insulectro offers a full line of DuPont™ metallization processes. 

About METALLIZATION

Insulectro offers a full line of DuPont™ metallization processes. For acid copper plating applications, there are multiple options depending on the application. A full range of DC plating systems, pulse plating, and via fill technologies are all available.

custom services

  • Tensile Strength & Elongation Testing
  • Copper Deposit Purity Testing
  • Total Organic Carbon (TOC)
  • Metallic Impurities
  • Full CVS Analyses

DC Copper Plating

DuPont™ COPPER GLEAM™ 2001

High aspect ratio, high throwing power DC panel or pattern plating process with excellent leveling and thickness distribution. Current denisty range of 5-20 ASF.

Product Details
DuPont™ COPPER GLEAM™ 125-EX

High throughput, fine grained DC pattern or panel plating process. Designed for plating applications with 10-30 ASF requirements where throughput and ease of control is desired.

Product Details
DuPont™ ELECTROPOSIT™ 1100

Mid to high current density copper plating system, with capabilities up to 40 ASF. Capable for panel or pattern plating applications.

Product Details
DuPont™ ELECTROPOSIT™ 1000

Excellent throwing power, surface distribution and leveling for low current density applications (<15 ASF).

Product Details

Via Fill

DuPont™ Microfill™ EVF

Provides enhanced via-filling performance while simultaneously through-hole plating at low surface thickness.

Product Details

Pulse Plating

DuPont™ COPPER GLEAM™ CuPulse

Thick panel, high aspect ratio applications utilizing PPR waveforms. Excellent performance with blind vias.

Product Details
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20362 Windrow Drive
Lake Forest, CA 92630
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