High-performing materials to enhance PCB technology for flexible and rigid boards
DuPont™ offers a comprehensive, industry-leading portfolio of materials and systems designed to meet today’s and the next generation’s design challenges.
There’s a broad portfolio of PCB materials including films, laminates, photoresists, and metallization. We continue to bring new products to market to create reliable PCBs with increased circuit density that function well under demanding environmental conditions.
DuPont™ Dry Films
Conventional 30 micron film. Maximize resolution and minimized costs.
Single wavelength(365nm) direct imaging 30 micron print and etch film. Good in alkaline and acid etching.
Dual wavelength (365nm/405nm) direct imaging 30 micron print and etch film. Good in alkaline and acid etching.
Dual wavelength (365nm405nm) direct imaging 1.5-2.5mil plating film. Improved adhesion over LDI7200.
Conventional film with superior chemical resistance designed for alkaline etch, copper plating as well as electrolytic Ni/Au.
Conventional 50 micron film. General purpose film.
These are conventional thick films. They can be used for electrolytic gold plating or conformance needs.
These are thin resists formulated for sub 25 micron resolution.
This film is a low leaching formulation specifically to be used for selective ENIG.
DuPont™ Flexible Laminates
High reliability Standard Flexible laminate with broadest construction offerings.
Consumer grade flexible laminates with limited construction offerings.
RF and MW capable flexible laminate.
Single sided Flexible Copper Clad Laminate.
Pyralux® FR is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates that is UL V-0 certified.
Pyralux® LF is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates.
Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225 C.
Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.
A unique Copper Clad laminate treated with Nickle Chrome to allow for embedded resistance designs.
Embedded capacitance material for rigid PCB applications with energy demanding HDI designs.
Low current density, high aspect ratio; Mid current density, high throughput.
Low current density, high aspect ratio; Mid current density, high throughput.
Reliable via filling technology; multiple variations based on geometries.
Periodic Pulse Technology for HDI Applications.
Palladium based DM process with a relative high conductive film for horizontal applications.
Palladium based DM process for through-hole and blind microvia applications.
Industry standard for low/mid-build electroless copper applications. Self-accelerating process with exceptional bath stability and process latitude.
Low-build tartrate based electroless copper system intended for flash or panel plate acid copper applications.
Excellent throwing power, surface distribution and leveling for low current density applications. (<15 ASF)
Designed for reliable through-hole plating of conventional Printed Circuit Boards. Aspect ratios up to 20:1.
DuPont™ Conductive Inks
A screen printable silver ink used to fabricate conductive traces on flexible substrates. This ink possesses excellent drying and film characteristics once processed.
A UV-curable, highly cross-linked screen printable blue dielectric. When cured this product provides an excellent solvent and moisture barrier with high dielectric strength for both rigid and flexible circuit manufacture.
DuPont 5056 is a unique solvent-based screen printable white ink that is formulated for the purpose of a flexible white reflective solder mask.
A solvent-based, screen printable highly-conductive silver-filled ink. It is recommended where high conductivity is a must in circuit applications
A silver conductive ink that has low silver content and low viscosity for spraying, dipping, and electroplating seed coating.
A silver conductive ink that is a higher viscosity version of DuPont 4817N targeted at brush or stylus application. This version will provide higher conductivity compared to DuPont 4817N.
A silver-filled, higher viscosity version of 4922N that is suitable for screen printing or stylus application.
A solvent-based, screen printable carbon ink that provides stable high resistance traces. It can also be used to make custom resistance blends.
A solvent-based, screen printable carbon that possesses good conductivity for printing polymer thick film traces
A screen printable, solvent-based phosphor-filled ink used for printing electroluminescent lamps. This provides a white lamp when powered and slight pink hue when not powered.
A solvent-based, screen printable silver conductive ink used for the generation of printed circuitry.
A solvent-based, epoxy resin, screen printable silver ink.
A conductive ink used for filling vias on a printed circuit board.
A silver-filled, conductive, solvent-based screen printable ink used for formable/moldable electronic applications.
A solvent-based screen printable ink used as a dielectric and a barrier layer for formable/moldable electronic applications.
A solvent-based formulation used to encapsulate components used on printed circuitry in formable/moldable electronic applications.
A silver-filled, conductive, solvent-based conductive adhesive used to attach components to printed circuitry in formable/moldable electronic applications.
This product enables rapid prototyping and a smooth transition from “lab to fab” with the versatility to scale up to industrial high-volume ink-jet print heads and machines. This allows circuit designers to immediately test a new design, quickly make necessary edits, and, due to reduced silver laydown, save on material costs. The technology also can be adapted to non-planar printing, enabling a series of new and emerging applications.
Part of the Intexar™ system. It is a screen printable carbon that provides excellent elongation and recovery for elongation and wearable fabric applications.
Part of the Intexar™ system. It is a screen printable dielectric that is formulated as a superior barrier coat and provides excellent elongation and recovery for elongation and wearable fabric applications.
A solvent-based screen printable silver coated copper composite ink that is receptive to soldering using the Apollo soldering system. This material has a chemistry which lends itself to higher end use temperatures up to ~ 160° C. It is compatible with the 5018 series dielectrics and can be overprinted with 7105 or 8144 carbons. A higher Silver coated copper:silver ratio version is available as PE826.
A unique solvent-based screen printable silver and silver-coated copper composite conductive ink that can be quickly dried in standard processing equipment at temperatures as low as 60°C and can be used on solvent sensitive and lower processing temperature substrates. PE828 is an all silver, lower resistance version of this product.
A solvent-based screen printable silver conductive ink that can be dried at low temperatures and used on solvent sensitive substrates.
Part of the Intexar™ system. It is a screen printable silver that is formulated for highly-conductive printed traces and provides excellent elongation and recovery for elongation and wearable fabric applications.
Part of the Intexar™ system. It is a screen printable silver that is formulated for highly-conductive printed exposed electrodes and provides excellent elongation and recovery for elongation and wearable fabric applications.
A screen printable, non-conductive dielectric that is compatible with the DuPont™ QM silver-based products.
A dielectric ink with a screen printable polyimide resin.
A conductive silver ink with a screen printable polyimide resin.
DuPont™ Substrates & Films
MELINEX® 329 is an opaque white, non-pretreated, polyester film with superb handling properties and a unique glossy appearance. MELINEX® 329 is used as a base for pressure sensitive labels, in security and access cards, in multiple use tickets and in general printing applications.
An opaque white polyester film with superb handling properties that is pretreated on both surfaces.
Tough, general purpose rough surface films that are transparent in 48 through 92 gauge and translucent in heavier gauges.
Heat-stabilized general purpose Mylar suitable for a wide range of applications.
A complete co-fireable family of silver and gold metallizations, buried passives, and encapsulants. DuPont™ GreenTape™ is a low temperature co-fired ceramic (LTCC) system.
Stretchable bi-layer thermoplastic polyurethane (TPU) film.