LOW-LOSS RF DIELECTRICS
Material choice can make or break your designs performance. We offer solutions.
About LOW LOSS RF DIELECTRICS
Low loss is our business. Whether it be attempting to minimize insertion loss or hit targeted impedance values, we have materials for all market places. Our materials are uniquely suited for pure package or hybrid design.
Ideal for RF Pure-Package or Hybrid Designs.
(They're Process-Compatible with FR4 like 370HR)
I-Tera® MT40 is a cost-effective solution for many of today’s high-speed digital and RF/microwave printed circuit designs.
TerraGreen® is a halogen-free solution for many of today’s high-speed digital and RF/microwave printed circuit designs.
Using thermoset prepregs we can achieve hyper-low-loss designs. Astra® MT77 provides extremely tight tolerances for thickness and signal performance.
DuPont™ Flex Materials for RF Applications
An innovative low loss epoxy adhesive for high speed flex designs.
A clad and bondply material constructed with FEP layers to minimize loss for RF based designs.
Low loss polyimide adhesive for high temp applications.
The industry standard flex substrate with incredibly low loss dielectrics to be used with HT film, TK bond plys or HP epoxy adhesives for low loss flex designs.
Also known as Rolled Annealed foil is often used for RF applications. It’s available as loose sheets for foil lamination with low loss dielectrics.