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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD ELECTRONICS
      • KYOCERA
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact

THERMAL MANAGEMENT

Thermal reliability, the hottest market place for designers.

About THERMAL MANAGEMENT

Thermal reliability has several influencing categories: Being able to withstand a high temperature environment (Like cables near a jet engine) or heat generated from electrical performance, such as inverters boards for electric cars!

custom services

  • PumaFast™
  • Rewinding Services
  • Manufacturing Technical Support
  • Designer Support

Polyimide

Isola® P95

Polyimide laminate for high temperature printed circuit applications.

Product Details
Isola® P25N

Polyimide-based no flow prepreg materials for high temperature printed circuit applications.

Product Details

Epoxy

Isola® IS550H

Halogen-free, low CTE, thermally stable for high temperature and high voltage applications.

Product Details

Flexible Boards

DuPont™ Pyralux® HT

The adhesive of choice for any High Temperature operation with an MOT of 225C.

Product Details

Copper Foil

Denkai America TOB-III

High reliability electrodeposited copper foil available in thicknesses up to 6 oz. (8.4 mils or 210 microns). Typically in stock in ½ thru 4 oz, thicker coppers can be used for thermal management applications.

Product Details
Wieland Wrought Foil

Also known as Rolled Annealed foil is generally stocked up to 3 oz (105 microns) thick. Rolled foil can be made in much higher thicknesses, up to 400 microns.

Product Details
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