Thermal reliability, the hottest market place for designers.
About THERMAL MANAGEMENT
Thermal reliability has several influencing categories: Being able to withstand a high temperature environment (Like cables near a jet engine) or heat generated from electrical performance, such as inverters boards for electric cars!
Polyimide laminate for high temperature printed circuit applications.
Polyimide-based no flow prepreg materials for high temperature printed circuit applications.
Halogen-free, low CTE, thermally stable for high temperature and high voltage applications.
The adhesive of choice for any High Temperature operation with an MOT of 225C.
High reliability electrodeposited copper foil available in thicknesses up to 6 oz. (8.4 mils or 210 microns). Typically in stock in ½ thru 4 oz, thicker coppers can be used for thermal management applications.
Also known as Rolled Annealed foil is generally stocked up to 3 oz (105 microns) thick. Rolled foil can be made in much higher thicknesses, up to 400 microns.