About EMD ELECTRONICS
High Density Interconnects (HDI) in PCBs have traditionally been made using electroplating. However, advanced requirements in ball grid array density, high PCB layer counts, and fine diameter vias have created the need for paste solutions.
Because the PCB layers connected by paste may be tested individually, as opposed to the sequential electroplating process that can only be tested in its final form, overall yields are significantly improved. Also, the Ormet® process requires a substantially lower capital investment than expensive plating lines and water treatment facilities and is much more environmentally friendly.
Ormet® pastes are lead-free, highly electrically and thermally conductive, and provide good solderability at relatively low temperatures. During the curing process, the material forms a solid metal, alloying with the copper circuits in the Z-axis. This forms a metallurgical bond stronger than mere contact. Once completed, the sintered metal will not re-flow until temperatures of 800°F.