Skip to the content

We’re hiring! View our list of current openings and start your new career.

InsulectroInsulectro
  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Final Finishes
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC & CSC
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA®
      • CAC & CSC INC.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD PERFORMANCE MATERIALS
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact
  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Final Finishes
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC & CSC
    • Suppliers
      • DUPONT™
      • ISOLA®
      • LCOA®
      • CAC & CSC INC.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUS TECH
      • EMD PERFORMANCE MATERIALS
      • DENKAI AMERICA
      • SHIKOKU
      • INDUBOND®
      • SHUR-LOC
      • JX NIPPON
      • INTERNATIONAL BRUSH CORPORATION
      • MITSUI KINZOKU
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Newsletter
  • Careers
  • Customer Portal
Contact

suppliers

InduBond®

About Indubond®

InduBond® has long been respected for tight accuracy in registration, its lamination presses, automation (automatic loading/unloading), and its eco-friendly best practices.

InduBond® X-PRESS lamination presses utilize a different way of producing the heat required for lamination using standard pressing methods. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material, of each layer of the press pack at the same time, at the same temperature level, without any thermal conduction.

Product Lines

InduBond® X1

A single head induction bonding system which incorporates a manual multi-line tooling plate with either round and/or slotted pins for pinless lamination. Can support either Rigid or Rigid-flex designs, panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.

Product Details
InduBond® RFX

Pin registration system with 4 independent heads to bond any locations in and around the perimeter of the panel, supporting Flex and Rigid-Flex designs. System supports pinless lamination which improves panel planarity by reducing warpage, also increases hit rate for laser drilling whilst supporting better tooling hole geometry. Panel registration with an x-ray viewer can be used prior to lamination to support image scaling factors and validation.

Product Details
Corporate Headquarters

Insulectro
20362 Windrow Drive
Lake Forest, CA 92630
Directions

View Stocking Locations

Contact

General Inquiries
Contact Us
Call (949) 587-3200

Job Opportunities
We’re hiring!
View open positions

Connect with Us
  • Vimeo
  • LinkedIn
  • YouTube

© Copyright 2022 Insulectro All trademarks belong to their respective owners.

Legal Privacy Policy