DuPont™ COPPER GLEAM™ 2001
High temperature stability electrodeposited copper foil for inner and outer layer applications with the treatment on the matte side of the foil.
- Uniform, bright, ductile deposit
- Excellent throwing power & thickness distribution
- Excellent through-hole micro-leveling
- Full analytical control of additive system by CVS
Explore our latest webinars, glossary, conversion calculator and more.