DuPont™ ELECTROPOSIT™ 1100
The Dow Electronic Materials ELECTROPOSIT™ 1100 Acid Copper plating additive is designed for reliable through-hole plating of conventional printed circuit boards. Use of the additive can significantly increase productivity while providing excellent leveling, surface distribution, and throwing paper when plating through-hole aspect ratios up to 10:1. Dow Electronic Materials can also provide processes for plating through-holes with aspect ratios up to 20:10.
- Utilizes conventional equipment
- Superior thermal shock resistance meets or exceeds MIL-P-55110D
- Ease of Control
- Straightforward Hull Cell interpretation
- Dow Electronic Materials ELECTROPOSIT™ Bath Analyzer for additive component analysis
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