DuPont™ ELECTROPOSIT™ 1000
The Dow High Aspect Ratio Plating System (SHARP) is designed for reliable through-hole plating of thick multi-layer printed circuit boards with hole aspect ratios up to 15:1. Dow can also provide processes for plating through-holes with aspect ratios greater than 15:1. Contact your Dow Technical Representative for more information.
The SHARP process consists of ELECTROPOSIT™ 1000 Plating Additives and a specially-developed high acid, lowcopper plating bath. This combination offers excellent throwing power at plating rates.
• Excellent throwing power, surface distribution, and leveling capabilities obtainable at practical plating rates
• Utilizes conventional equipment
• Exceptional thermal stress resistance–meets or exceeds MIL-P-55110 D
• Ease of control
• Straight forward Hull Cell interpretation
• Surface-to-hole thickness ratios better than 2:1 for hole aspect ratios of up to 15:1