Industry-standard for low/mid-build electroless copper applications. It features a self-accelerating process with exceptional bath stability and process latitude for through-hole metallization applications as well as an excellent process for high-performance multilayers and HDI applications.
• Patented formulation eliminates the need for separate accelerator
• EDTA/Formaldehyde-based system
• High reliability, low-stress, fine-grain deposit
• Deposits 50µ” in 30 minutes