DuPont™ CUPOSIT™ 328-L
Low-build electroless copper system intended for flash or panel plate acid copper applications. Stable, easy to operate system produces good coverage on hard to plate substrates.
- Tartrate/Formaldehyde based system
- Smooth, fine grained, uniform bright pink copper deposit
- Excellent copper-to-copper bond with all electroplate copper systems
- Produces 15-20µ” copper deposit in 20 minutes
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