Ormet® PCB-710 is a Pb-free paste formulated for filling microvias within printed circuit boards. Ormet® PCB-710 filling paste is designed for stacked vias to form vertical interconnects allowing PCB designers to maximize circuit density and minimize the number of lamination cycles required to manufacture high layer count PCB’s.
• Desired filling diameters: <200um with <1:1 aspect ratio
• Ability to extend high aspect ratio, plated through holes while maintaining standard drill techniques
• Enables blind and buried vias while reducing lamination cycles • Via-in-pad design interconnects in multi-layer substrates • Stable electrical resistance over time and temperature