Key Properties

  •   Improve the adhesion between copper and variety of resin such as insulating materials for inner layer and solder mask without roughening copper surface.
  • Smooth copper surface makes excellent signal integrity especially at high frequency range.

  • It’s suitable for fine pitch copper circuit due to no microetching

  •  No pretreatment required on copper such as Tin plating, but just acid cleaning by simple horizontal immersion process

  •  Novel organic coating only on copper directly by chemical reaction. No residue on solder mask and insulating materials.