Shikoku Glicap® GC-750
Description
GliCAP® is newly developed process to improve the adhesion between copper and variety of resin without roughening copper surface by effect of very thin organic coating, composed of novel organic azole compound which is developed by our organic synthesis technology.
Key Properties
- Improve the adhesion between copper and variety of resin such as insulating materials for inner layer and solder mask without roughening copper surface.
Smooth copper surface makes excellent signal integrity especially at high frequency range.
It’s suitable for fine pitch copper circuit due to no microetching
No pretreatment required on copper such as Tin plating, but just acid cleaning by simple horizontal immersion process
Novel organic coating only on copper directly by chemical reaction. No residue on solder mask and insulating materials.
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