Ormet® PCB-701 is a lead-free conductive paste used to fill micro via structures that create z-axis interconnections between circuit layers in semiconductor packaging and printed circuit boards. Ormet® PCB-701 is used in via fill applications to increase yield and reduce product manufacturing time. Ormet® PCB-701 also enables an alternative z-axis interconnect solution in printed circuit boards for many advanced interconnection designs where plating processes are cost and/or yield prohibited.
Some applications that may be candidates for Ormet® PCB-701 include:
• Filling high-aspect ratio holes (down to 50um in diameter) where plating is a time consuming and low yield process
• Enabling the placement of blind and buried vias in multilayer substrates at lower cost and at a higher throughput and yield than sequential copper plating
• Interconnecting layers in via-in-pad PCB applications