DuPont™ CUPOSIT™ 328-L
A low-build electroless copper system intended for flash or panel plate acid copper applications. It features a stable, easy-to-operate system that produces good coverage on hard to plate substrates.
• Tartrate/Formaldehyde-based system
• Smooth, fine-grained, uniform bright pink copper deposit
• Excellent copper-to-copper bond with all electroplate copper systems
• Produces 15-20µ” copper deposit in 20 minutes
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