Shikoku Glibrite® GB-4300
Glibrite® GB-4300R40 is an additive for copper roughening solution based on hydrogen peroxide and sulfuric acid, which is designed for solder mask preparation, in order to give the best adhesion with lower etching amount.
Clean copper oxidation thoroughly, and make dense and uniform copper surface topography with lower etching amount, in order to give the best adhesion of solder mask
Lower etching amount is essential for fine pattern copper circuit and high frequency requirement of the next generation PWBs.
Stable etching speed makes easy maintenance.
Applicable by either spray or dip system
Stable etching amount even in case of higher copper ion concentration could last the solution longer.
Easy waste treatment based on hydrogen peroxide and sulfuric acid solution.