Key Properties

  • Clean copper oxidation thoroughly, and make dense and uniform copper surface topography with lower etching amount, in order to give the best adhesion of solder mask

  •  Lower etching amount is essential for fine pattern copper circuit and high frequency requirement of the next generation PWBs.

  •  Stable etching speed makes easy maintenance.

  • Applicable by either spray or dip system

  • Stable etching amount even in case of higher copper ion concentration could last the solution longer.

  • Easy waste treatment based on hydrogen peroxide and sulfuric acid solution.