DURAPOSIT™ SMT-88; AUROLECTROLESS 520
Description
Aurolectroless™ SMT-520 Immersion Gold is the latest final finish product from Qnity™ (formerly DuPont Electronic Solutions). Designed to lower board manufacturer’s ENIG process costs, while maintaining optimum reliability and performance. The product delivers uniform, fine-grained deposits of pure gold on substrates including electroless nickel and palladium.
ENIG deposits formed in conjunction with Qnity™‘s Duraposit™ SMT 88 Electroless Nickel bath deliver excellent shelf life and solder joint performance
Key Properties
- Up to 50% lower make-up and running cost
- Flexible gold thickness control
- Uniform and low porosity deposits
- Excellent corrosion resistance
- Excellent bath life and stability (up to 20 MTO)
Tools
Explore our latest webinars, glossary, conversion calculator and more.