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    • Mission, Vision and Values
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    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
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      • CAC® & CSC™
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      • DUPONT™
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      • LCOA™
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      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUSTECH™
      • AI TECHNOLOGY, INC.
      • INDUBOND®
      • KYOCERA
      • CHANG CHUN PETROCHEMICAL
      • DENKAI AMERICA
      • JX METALS CORPORATION
      • MITSUI KINZOKU
      • SHIKOKU
      • INTERNATIONAL BRUSH CORPORATION
      • FLEXCON
    • Product Availability
      • PumaFast™
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suppliers

DuPont™

About dupont™

High-performing materials to enhance PCB technology for flexible and rigid boards

DuPont™ offers a comprehensive, industry-leading portfolio of materials and systems designed to meet today’s and the next generation’s design challenges.

There’s a broad portfolio of PCB materials including films, laminates, photoresists, and metallization. We continue to bring new products to market to create reliable PCBs with increased circuit density that function well under demanding environmental conditions.

DuPont™ Product Lines
  • DuPont™ Dry Films
  • DuPont™ Flexible Laminates
  • DuPont™ Chemistry
  • DuPont™ Substrates & Films

DuPont™ Dry Films

Conventional Inner Layer: DuPont™ RISTON® TM213

Conventional 30 micron film. Maximize resolution and minimized costs.

Product Details
Direct Inner Layer: DuPont™ RISTON® LDI7300 (30 micron)

Single wavelength(365nm) direct imaging 30 micron print and etch film. Good in alkaline and acid etching.

Product Details
Direct Inner Layer: DuPont™ RISTON® DI9330

Dual wavelength (365nm/405nm) direct imaging 30 micron print and etch film. Good in alkaline and acid etching.

Product Details
Direct Outer Layer: DuPont™ RISTON® 3000 (38,50,62 micron)

Dual wavelength (365nm405nm) direct imaging 1.5-2.5mil plating film. Improved adhesion over LDI7200.

Product Details
Conventional Outer Layer: DuPont™ RISTON® MM500 (30,50 micron)

Conventional film with superior chemical resistance designed for alkaline etch, copper plating as well as electrolytic Ni/Au.

Product Details
Conventional: DuPont™ RISTON® MM100 (50 micron)

Conventional 50 micron film. General purpose film.

Product Details
Selective Strip: DuPont™ RISTON® GM100 (3 and 4 mil)

These are conventional thick films. They can be used for electrolytic gold plating or conformance needs.

Product Details
MSAP: DuPont™ RISTON® DI5100 (15, 25 micron)

These are thin resists formulated for sub 25 micron resolution.

Product Details
Selective ENIG: DuPont™ RISTON® FX250

This film is a low leaching formulation specifically to be used for selective ENIG.

Product Details

DuPont™ Flexible Laminates

DuPont™ Pyralux® AP

High reliability Standard Flexible laminate with broadest construction offerings.

Product Details
DuPont™ Pyralux® AG

Consumer grade flexible laminates with limited construction offerings.

Product Details
DuPont™ Pyralux® TK

RF and MW capable flexible laminate.

Product Details
DuPont™ Pyralux® AC

Single sided Flexible Copper Clad Laminate.

Product Details
DuPont™ Pyralux® FR

Pyralux® FR is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates that is UL V-0 certified.

Product Details
DuPont™ Pyralux® LF

Pyralux® LF is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates.

Product Details
DuPont™ Pyralux® HT

Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225°C.   

Product Details
DuPont™ Pyralux® HP

Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.

Product Details
DuPont™ Pyralux® APR

A unique Copper Clad laminate treated with Nickle Chrome to allow for embedded resistance designs.

Product Details
DuPont™ Interra® HK04M and HK04J

Embedded capacitance material for rigid PCB applications with energy demanding HDI designs.

Product Details

DuPont™ Chemistry

DuPont™ COPPER GLEAM™ 2001

Low current density, high aspect ratio; Mid current density, high throughput.

Product Details
DuPont™ COPPER GLEAM™ 125-EX

Low current density, high aspect ratio; Mid current density, high throughput.

Product Details
Via Fill: DuPont™ Microfill™ EVF

Reliable via filling technology; multiple variations based on geometries.

Product Details
Pulse Plating: DuPont™ COPPER GLEAM™ CuPulse

Periodic Pulse Technology for HDI Applications.

Product Details

Interconnect Solutions

Direct Metallization: DuPont™ CRIMSON™

Palladium based DM process with a relative high conductive film for horizontal applications.

Product Details
Direct Metallization: DuPont™ CONDUCTRON™

Palladium based DM process for through-hole and blind microvia applications.

Product Details
Electroless Copper: DuPont™ CIRCUPOSIT™ 3350-1

Industry standard for low/mid-build electroless copper applications. Self-accelerating process with exceptional bath stability and process latitude.

Product Details
Electroless Copper: DuPont™ CUPOSIT™ 328-L

Low-build tartrate based electroless copper system intended for flash or panel plate acid copper applications.

Product Details
DuPont™ ELECTROPOSIT™ 1000

Excellent throwing power, surface distribution and leveling for low current density applications.            (<15 ASF)

Product Details
DuPont™ ELECTROPOSIT™ 1100

Designed for reliable through-hole plating of conventional Printed Circuit Boards. Aspect ratios up to 20:1. 

Product Details

DuPont™ Substrates & Films

DuPont Teijin Films™ Melinex® 329

MELINEX® 329 is an opaque white, non-pretreated, polyester film with superb handling properties and a unique glossy appearance. MELINEX® 329 is used as a base for pressure sensitive labels, in security and access cards, in multiple use tickets and in general printing applications.

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DuPont Teijin Films™ Melinex® 339

An opaque white polyester film with superb handling properties that is pre­treated on both surfaces.

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DuPont Teijin Films™ Mylar A

Tough, general purpose rough surface films that are transparent in 48 through 92 gauge and translucent in heavier gauges.

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DuPont Teijin Films™ Mylar ADS

Heat-stabilized general purpose Mylar suitable for a wide range of applications.

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DuPont™ GreenTape™ 951

A complete co-fireable family of silver and gold metallizations, buried passives, and encapsulants. DuPont™ GreenTape™ is a low temperature co-fired ceramic (LTCC) system.

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DuPont™ Intexar™ TE-11C Film

Stretchable bi-layer thermoplastic polyurethane (TPU) film.

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