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DuPont™
About dupont™
High-performing materials to enhance PCB technology for flexible and rigid boards
DuPont™ offers a comprehensive, industry-leading portfolio of materials and systems designed to meet today’s and the next generation’s design challenges.
There’s a broad portfolio of PCB materials including films, laminates, photoresists, and metallization. We continue to bring new products to market to create reliable PCBs with increased circuit density that function well under demanding environmental conditions.
DuPont™ Dry Films
Conventional 30 micron film. Maximize resolution and minimized costs.
Single wavelength(365nm) direct imaging 30 micron print and etch film. Good in alkaline and acid etching.
Dual wavelength (365nm/405nm) direct imaging 30 micron print and etch film. Good in alkaline and acid etching.
Dual wavelength (365nm405nm) direct imaging 1.5-2.5mil plating film. Improved adhesion over LDI7200.
Conventional film with superior chemical resistance designed for alkaline etch, copper plating as well as electrolytic Ni/Au.
Conventional 50 micron film. General purpose film.
These are conventional thick films. They can be used for electrolytic gold plating or conformance needs.
These are thin resists formulated for sub 25 micron resolution.
This film is a low leaching formulation specifically to be used for selective ENIG.
DuPont™ Flexible Laminates
High reliability Standard Flexible laminate with broadest construction offerings.
Consumer grade flexible laminates with limited construction offerings.
Pyralux® FR is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates that is UL V-0 certified.
Pyralux® LF is a acrylic based adhesive system for building flex circuits. Offered as coverlays, bondplys, sheet adhesives and copper clad laminates.
Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225°C.
Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.
A unique Copper Clad laminate treated with Nickle Chrome to allow for embedded resistance designs.
Embedded capacitance material for rigid PCB applications with energy demanding HDI designs.
DuPont™ Chemistry
Low current density, high aspect ratio; Mid current density, high throughput.
Low current density, high aspect ratio; Mid current density, high throughput.
Reliable via filling technology; multiple variations based on geometries.
Periodic Pulse Technology for HDI Applications.
Interconnect Solutions
Palladium based DM process with a relative high conductive film for horizontal applications.
Palladium based DM process for through-hole and blind microvia applications.
Industry standard for low/mid-build electroless copper applications. Self-accelerating process with exceptional bath stability and process latitude.
Low-build tartrate based electroless copper system intended for flash or panel plate acid copper applications.
Excellent throwing power, surface distribution and leveling for low current density applications. (<15 ASF)
Designed for reliable through-hole plating of conventional Printed Circuit Boards. Aspect ratios up to 20:1.
DuPont™ Substrates & Films
MELINEX® 329 is an opaque white, non-pretreated, polyester film with superb handling properties and a unique glossy appearance. MELINEX® 329 is used as a base for pressure sensitive labels, in security and access cards, in multiple use tickets and in general printing applications.
An opaque white polyester film with superb handling properties that is pretreated on both surfaces.
Tough, general purpose rough surface films that are transparent in 48 through 92 gauge and translucent in heavier gauges.
Heat-stabilized general purpose Mylar suitable for a wide range of applications.
A complete co-fireable family of silver and gold metallizations, buried passives, and encapsulants. DuPont™ GreenTape™ is a low temperature co-fired ceramic (LTCC) system.