Whitepapers

October 19th, 2022

Advanced Via Solutions (Part 1/3)

Author: Michael Creeden CID+ Technical Director Design Education

Advanced circuit requirements are presenting new challenges every year. These challenges are
driven by the ever-increasing need to be smaller, faster, accomplish more, be cheaper, and often
must be accomplished quicker. So, each year we try to meet these needs by working smarter,
faster, more efficiently, adding technology and innovation. One of the most challenging features
on our circuit boards are the vias by which we make Z interconnects...

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October 19th, 2022

Advanced Via Solutions (Part 2/3)

Author: Michael Creeden CID+ Technical Director Design Education

Z-axis Interconnects can be completed by a technology called, Transient Liquid Phase Sintering (TLPS) materials, which is the use of copper sintering paste, i.e., Ormet® Paste Z-Interconnects,
this can be a very helpful alternative solution to conventional microvias. Ormet® Paste is an alloy
compound of Copper (Cu), Tin (Sn), and Bismuth (Bi) used as the binding agent...

October 19th, 2022

Advanced Via Solutions (Part 3/3)

Author: Michael Creeden CID+ Technical Director Design Education

Today’s circuit boards often contain many rationales to implement HDI routing strategies.
HDI/Microvia Routing – There are several reasons to consider using HDI technology when
routing a circuit board. The most common of which is to improve the routability of the devices on the board, this means how many traces per each layer...

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August 26th, 2022

Signal Integrity, Electro-Magnetic Interference & Compatibility

Author: Michael Creeden CID+ Technical Director Design Education

Signal Integrity is a process to determine that the signal was delivered properly through a transmission line. Thus, a net could have good signal integrity or bad signal integrity. We must also consider that each net could induce a bad signal integrity phenomena to any adjacent net. This concept can have further-reaching concerns when energy emissions radiate and affect...

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August 23th, 2022

Universal Intelligent Input Data

Author: Michael Creeden CID+ Technical Director Design Education

Most great ideas originate with unknown sources, then someone claims the innovation. However, I’ve read somewhere that there is nothing new under the sun. All that to say, I’ve been talking this idea around for several years and I’m sure the smartest person in the room actually created it and that’s not me. I just wanted to go on record as someone pushing the idea forward…

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May 23rd, 2022

Copper Electroplating Fundamentals

Author: DuPont™

Copper pillars are now common in flip chip interconnection, usually with a lead-free SnAg solder cap on top.

The transition to copper pillars has been driven by the limitations related to size and pitch (space between features) of traditional controlled collapse chip connection (C4) bumping.

As pitch requirements continue to shrink, copper pillars can....

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February 7th, 2022

The Battles To Reduce RF Loss

Author: Michael Creeden CID+ Technical Director Design Education

Dielectric Losses (Df) is the absorption of electromagnetic energy by the board material in a varying electric field. This is critical for minimizing dB loss calculations and is of high value to RF circuits. There are...

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April 8th, 2022

Plating on Plastics & Metal

Author: DuPont™

Plating on Plastics and Metal Finishing Technologies delivers integrated materials and surface finishing processes for use in electronics, optoelectronics, and industrial applications worldwide.

Our processes provide essential functionality to the end-use markets we serve, including reliable interconnects for electronic packaging, EMI shielding of....

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February 11th, 2022

Laminate Basics for Stackup Design

Author: Michael Creeden CID+ Technical Director Design Education

Laminates are comprised of three basic elements: Resin, Glass-weave and Copper. The resin is for bonding, the glass-weave is for rigidity, and the
copper is for conductivity. Each element plays a vital role in...

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December 20, 2021

Films for Improved Reliability in Rigid Printed Circuit Boards

Author: Chris Hunrath, Insulectro Vice President of Technology ABSTRACTThe Printed Circuit Board industry has been dominated by fiberglass cloth-based materials for many years. Good reasons include cost, as well as thermal and mechanical stability. Glass fabric provides a substrate for…

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September 13, 2021

Building HDI Structures Using Thin Films and Low Temperature Sintering Paste

ABSTRACT Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult to achieve in good yield with current fabrication strategies. The trend is to bring the…

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September 13, 2021

Where PCB’s and Printed Electronics Meet

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September 8, 2021

5G Rollout Still Progressing

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