INTERCONNECT SOLUTIONS
Insulectro offers a variety of Interconnect metallization solutions for through hole, blind via and advanced HDI applications.
About INTERCONNECT SOLUTIONS
Insulectro offers a variety of DuPont™ Interconnect metallization solutions for through hole, blind via and advanced HDI applications.
custom services
- Line Audits
- Process Training
Electroless Copper
Industry standard for low/mid-build electroless copper applications. Self-accelerating process with exceptional bath stability and process latitude.
Low-build tartrate based electroless copper system intended for flash or panel plate acid copper applications.
Direct Metallization
Palladium based DM process with a relative high conductive film for horizontal applications.
Palladium based DM process for through-hole and blind microvia applications.
Paste Interconnect
Patented, lead-free, TLPS sintering paste designed to create innerconnects in a PCB or to combine PCBs. Microvia filling paste for z-axis interconnects.
Patented, lead-free, TLPS sintering paste designed to create innerconnects in a PCB or to combine PCBs with a slightly higher metal loading than 701 or better thermal and electrical properties. Advanced paste for high-layer-count PCBs.