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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • CELANESE MICROMAX®
      • ARLON ELECTRONIC MATERIALS
      • EMC (ELITE MATERIALS COMPANY)
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUSTECH™
      • AI TECHNOLOGY, INC.
      • INDUBOND®
      • KYOCERA
      • CHANG CHUN PETROCHEMICAL
      • DENKAI AMERICA
      • JX METALS CORPORATION
      • MITSUI KINZOKU
      • SHIKOKU
      • INTERNATIONAL BRUSH CORPORATION
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
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  • Careers
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Contact

HIGH-SPEED DIGITAL

A successful high-speed digital product is reliant upon the PCB material selected. Several factors, such as the maximum data rate, the length of the high-speed digital channel, as well as thermal and processing considerations should be taken into account when choosing a material.

About HIGH-SPEED DIGITAL

Our High-speed Digital materials deliver superior performance and CAF resistance. These low-loss materials are targeted for applications that require high reliability and signal integrity.

custom services

  • PumaFast™
  • Rewinding Services
  • Manufacturing Technical Support
  • Designer Support

Oxide

Shikoku Glicap® GC-750

Non-etching oxide alternative. Engineered for High Speed Digital and RF applications.

Product Details

Rigid Laminates

EMC EM-528

Multiple lamination and high thermal reliability applications including: high-speed server, network, and telecom. 

High Tg / Very Low Loss / Halogen Free.

Applicable IPC Slash Sheets: IPC-4103 /240, /540.

Product Details
EMC EM-890K

Designed for high thermal reliability with excellent CAF resistance. Applications include: high-speed Ethernet, network, HPC, AI, 5G, and antenna.

High Tg / Ultra Low Loss / Halogen Free.

Applicable IPC Slash Sheets: IPC 4101 /134; IPC-4103 /230, /530.

Product Details

Ormet® Sintering Paste

Ormet® 701

Patented, lead-free, TLPS sintering paste designed to create innerconnects in a PCB or to combine PCBs                                                                                                                                                       

Product Details
Ormet® 710

Patented, lead-free, TLPS sintering paste designed to create innerconnects in a PCB or to combine PCBs with a slightly higher metal loading than 701 or better thermal and electrical properties.

Product Details

Flexible Laminates

DuPont™ Pyralux® AP

RF and MW capable flexible laminate.

Product Details
DuPont™ Pyralux® TK

RF and MW capable flexible laminate. 

Product Details
DuPont™ Pyralux® HT

Pyralux® HT is a high temperature film that can be used as a bondply, coverlay or sheet adhesive for applications with an MOT up to 225 C.  

Product Details
DuPont™ Pyralux® HP

Pyralux® HP is the newest adhesive to the Pyralux® line up. It is low-loss epoxy based adhesive that is ideal for any situation where signal integrity is a driving factor in the design.

Product Details

Copper Foils

JX Metals Corporation JXEFL

Ultra-Low Profile treatment with good bonding characteristics for lower signal loss on high speed designs.

Product Details
Wieland Wrought Foil

Also known as Rolled Annealed foil. This is a popular choice for high speed applications due to its structure and low profile treatment. It’s available as a loose foil for both sub and outerlayer applications.

Product Details

OSP

Shikoku Glicoat® SMD F2LX

Best-in-Class OSP coating.

Product Details
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