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INSULECTRO HIRES OPERATIONS EXPERT JOE HARBOUR AS DIRECTOR OF OPERATIONS, EAST & MIDWEST REGIONS

LAKE FOREST, CA – MAY 16, 2022

“I am pleased to announce a new teammate to our Insulectro Operations team, Joe Harbour,” announced Ken Parent, Insulectro Chief Operating Officer, “Joe comes to us with an extensive and diverse background in the design, development, implementation, and management of world class operations. He is experienced and skilled in driving LEAN operational culture, focused on Safety, Quality, and Service.  He will report to Jason Shuppert, VP Operations & Supply Chain.”

Harbour has over 15 years of operational experience, having spent the first 6 years of his career in the U.S. Air Force, as a Command Control Leader and Project Manager.  Here Harbour achieved the highest ratings for conducting specialized and advanced training for military personnel.  Joe has spent the last eight years with the TJX Companies, Inc. (TJ Maxx, Home Goods, Marshalls) where most recently he held the position of Regional Operations/Loss Prevention Manager.  In this role he provided executive-level operational leadership in the Eastern U.S. for five, 1 million+ square feet distribution and fulfillment centers.  Joe is the recipient of the 2022 “World Class Winner Award” by TJX Inc., for his leadership in implementing a standard DC staffing model that supported a transition to 24/7 operations and for championing efforts to promote a safe work environment with focus on incident de-escalation and workplace safety awareness and compliance.

“I’m very excited to have Joe Harbour joining our Puma Family, spearheading operational oversight in the East & Midwest Regions” stated Vice President of Operations Jason Shuppert. “Joe will bring much needed knowledge and insight in the areas of Safety, Quality, and Service best practices, to drive our World Class Manufacturing culture and our overall operating results forward.”

Ken Parent concluded, “Joe is a wonderful talent to add to our bench of superstars and will have an immediate impact helping us accelerate our WCM focus on People, Quality, Service, and Asset Care.  Insulectro certainly continues to grow and expand to help our customers build better circuits, faster.”

Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech, JX Nippon, TADCO, EMD Performance Materials (Ormet®), Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, InduBond®, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326   [email protected]

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DUPONT OPENS NEW KAPTON® AND PYRALUX® PRODUCTION LINE IN CIRCLEVILLE, OHIO

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$250 Million Capital Investment Expands Supply of Innovative DuPont Materials to Meet Growing Global Demand.

WILMINGTON, Del., May 6, 2022 – DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, today held a ribbon-cutting ceremony with elected officials and business leaders to formally mark the completion of its $250 million capital project to expand production of Kapton® polyimide film and Pyralux® flexible circuit materials at the Circleville manufacturing site.

“The opening of the production line in Circleville marks a major milestone for DuPont and Electronics & Industrial,” said Jon Kemp, president of DuPont Electronics & Industrial. “The Kapton® and Pyralux® expansion will help ensure supply of innovative materials to meet the growing global customer demand in the automotive, consumer electronics, telecommunications, specialized industrial and defense segments. It also demonstrates our ongoing commitment to being the partner of choice for our customers and delivering them new products with higher reliability and supply assurance.”

DuPont employs more than 1,000 people across eight locations in Ohio, including 500 people at its site in Circleville. Kemp said, “DuPont is proud to play an integral role in Ohio’s plans to expand its semiconductor and electronics manufacturing ecosystem.”

This new manufacturing line uses DuPont proprietary processing capabilities to produce advanced Kapton® polyimide films, which have set industry standards for more than 50 years, offering high performance, reliability and durability. Kapton® polyimide films offer a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments.

Kapton® polyimide film is also at the heart of DuPont’s Pyralux® line of flexible copper-clad laminates that are available in a wide variety of copper types, thicknesses and construction options, all of which offer excellent thermal, chemical, electrical and mechanical properties. Pyralux® laminates are ideal for use in a wide variety of multi-layer flex and rigid-flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, robust thermal resistance and high reliability.

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INSULECTRO TO EXHIBIT AT DEL MAR ELECTRONICS SHOW THIS WEEK

LAKE FOREST, CA – MAY 2, 2022

After a two-year hiatus caused by the COVID pandemic, Insulectro, the largest distributor of materials for use in manufacture of printed circuit boards and printed electronics, is exhibiting at the Del Mar Electronics & Manufacturing show May 4 and 5, 2022 in Del Mar, CA.

“Insulectro is looking forward to once again participating in Southern California’s own electronics tradeshow – the Del Mar Electronics & Manufacturing show held this week at the Del Mar Fairgrounds,” announced Ken Parent, Insulectro Chief Operating Officer, “It’s good to be back!”

The Del Mar Show markets itself as a place to find productive and fun ideas for design, assembly & manufacturing, as well as quality & testing. A smaller show by some standards, this show is renowned for the quality of exhibitors and of the technical seminars. The interaction of industry leaders is unmatched.

“Located in space 101 in the Bing Crosby Hall, we are flanked on either side by two of our premier suppliers – Isola and DuPont® (which will feature its MCM product line of conductive inks and pastes). Attendees will find spaces 100, 101, and 102 to be the ‘power corner’ of the exhibition,” Parent continued. “With our Design Education program, we have been emphasizing to OEMs, fabricators, and designers the importance of selecting not only the right materials but following through to ensure they are used properly for maximum productivity. We can help with that.

“Our two experts on that subject – Michael Creeden CID+, Technical Director and Laura Martin, Director of Technology – are ready to discuss that with you. Michael is a well-known personality in our industry and an expert on strong, producible designs. Laura has recently joined Insulectro after a lengthy career with Lockheed Martin where she held a variety of high-profile positions. She knows what OEMs expect,” Parent concluded.

The Del Mar Show hours on May 4th from 10:00 AM to 5:00 PM and May 5th from 10:00 AM to 3:00 PM. Attendance is free, and you use this link to register: https://www.mfgshow.com/electroshows/delreg.html.

Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech, JX Nippon, TADCO, EMD Performance Materials (Ormet®), Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, InduBond®, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326   [email protected]

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INSULECTRO GEARS UP FOR MORE BUSINESS IN CANADA

North America’s largest distributor of materials for use in manufacture of printed circuit boards and printed electronics, has broadened its commitment to Canadian business. It has acquired more warehouse space at 237 Unit 1 Finchdene Square, Scarborough Ontario M1X 2E1 Canada significantly increasing its local presence and capabilities in Canada.


“Insulectro continues be optimistic about the electronics business and we are pleased to announce our increased investment in the Northeast Canadian market,” announced Ken Parent, Insulectro Chief Operating Officer, “Our goal is to continue to improve our focus and service to our local Canadian customers.”


Rudy Chavarria has been hired as Operations Supervisor at this new Insulectro location. Our local Technical Account Manager Michael Currie will be point person in the PCB market. Bob Lee will continue to be TAM and point person for Printed Electronics business. Ron Murdock, Insulectro’s Director of Sales Eastern Region will manage this PCB territory. Kevin Miller, Insulectro VP of Sales for Printed Electronics will manage the PE business in the marketplace. A list on pertinent contacts with phone numbers and emails is available for Insulectro’s technical account managers, inside sales managers, field application engineers and product managers.


Ken Parent concluded, “Insulectro appreciates all the support and our relationship with First Electronics and Chester Cartage over the years, as they have helped us get to this position in the marketplace. We expect this continue even stronger with the additional warehouse space that enables us to support our customers.


Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech, JX Nippon, TADCO, EMD Electronics (Ormet®), Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, InduBond®, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:
John A. Lee
Vice President of Marketing & Brand Strategy
Insulectro
949.587.3326 [email protected]

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INSULECTRO HIRES INDUSTRY VETERAN DOUG GOTELLI AS TECHNICAL ACCOUNT MANAGER IN ITS SAN JOSE BRANCH

“Today, I’m welcoming Doug Gotelli to the Puma Team,” announced Ken Parent, Insulectro Chief Operating Officer, “Doug has had a very impressive career with many high-profile positions throughout the supply chain.”

Gotelli has an extensive background in PCB fab/assembly/integration/supply sales and account management with such firms as Compass Electronics Solutions, MacDermid Alpha, Minco Products, Endicott Interconnect, and Tyco.

“I’ve known Insulectro since my start in the PCB business. The first ‘business lunch’ of my career was with Tom Earle and Anne Garibaldi when I worked in procurement/purchasing at a small PCB factory back in 1979! From that day on, I’ve had such respect and admiration for Insulectro. To have the opportunity of joining Insulectro at this juncture in my career is both extraordinary and humbling,” Gotelli commented.

Gotelli will report to Chris Hunrath, Insulectro VP of Technology. Hunrath’s responsibilities have recently increased with the sales leadership role for Northern and Southern California being added. In addition to his Technology title, Hunrath is now also Vice President of Sales – Western Region.

Ken Parent concluded, “Doug’s enviable track record is pinned to his driving goal of long-term customer engagement. We’re glad he’s now carrying an Insulectro business card.”

Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech, JX Nippon, TADCO, EMD Performance Materials (Ormet®), Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, InduBond®, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326   [email protected]

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PWB COMMODITY SPECIALIST LAURA MARTIN JOINS AS DIRECTOR OF TECHNOLOGY

“I am pleased to announce a new teammate joining our team of superstars,” announced Ken Parent, Insulectro Chief Operating Officer, “Laura Martin joins us after a lengthy career with Lockheed Martin where she held a variety of high-profile positions. In the new position, Director of Technology, she will work closely on our Design Education initiative lead by Technical Director Michael Creeden, CID+. As an engineer working for a major aerospace OEM, Laura brings a unique skill set to Insulectro essential to our growth objectives.”

Martin held a variety of positions at Lockheed Martin over a 19-year career, most recently as PWB Commodity Specialist and Producibility Engineering Department Lead in the Missiles and Fire Control division. Her duties focused on bridging the gap between design and manufacturing by analyzing supplier capabilities and adjusting design rules as technology evolved.  Martin worked closely with buyers to identify suppliers capable of building complex boards; and working with assembly to identify issues relating back to design and bare board manufacturing.

Other positions at Lockheed included Project Engineer, Technician Process Senior Specialist among others. Martin holds a Bachelor of Science degree in Industrial Engineering from University of Central Florida plus several Certifications including: IPC-A-600 Acceptability of Printed Boards, DxDesigner for Expedition PCB Flow, and is a Green Belt in Lean Six Sigma. Martin also recently published a technical paper on machine learning at IEEE’s SoutheastCon.

“I look forward to joining the Insulectro team. With my work on the OEM side of the industry, I understand how important it is to select the optimal materials and to be sure those materials are used in a manner that will maximize yield and productivity. Insulectro’s work in Design Education is their pledge to ensure that,” said Martin.

Ken Parent concluded, “Laura brings wonderful talents to our team. Her unique skills and experience will help Insulectro continue to expand on our mission to help our customers build better circuits, faster.”

Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech, JX Nippon, TADCO, EMD Performance Materials (Ormet®), Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, InduBond®, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex, and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326   [email protected]

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INSULECTRO APPOINTS INDUSTRY VETERANS JOAN VRTIS AND JEFF DOUBRAVA TO ADVISORY BOARD

Joan K. Vrtis PhD has held several circuit technology positions in her long successful career.  In the 1990s, working for Intel Corp., she developed substrate and polymer solutions for the Pentium product line.  Upon leaving Intel, Dr. Vrtis and a business partner acquired FlipChip International, a leading WLP/CSP technology company based in Phoenix, AZ.  She held the CTO position until divesting her stake in late 2008.  After working with start-ups for several years as CTO (Kemeta) and COO (Shocking Technology), she joined Multek, Ltd, developing their San Jose, CA & Zhuhai China Interconnect Technology Centers. She held the role of CTO until 2018 and transferred to Flex, Ltd as SVP of Innovation & Technology Integration until she retired mid-2019.

Dr. Vrtis holds several patents in materials, circuit structures and process.  She has been a speaker at various conferences and participated on several technology panels promoting advanced circuit technology and its applications.  She holds a PhD & MS Polymer Science & Engineering (Univ. of Massachusetts Amherst), Masters in Metallurgy & Materials (Illinois Institute of Technology), B.S. Chemistry (Univ. of Illinois, Chicago) and an MBA (DePaul University).  She is an avid outdoors person and enjoys traveling the world to visit family and friends.

Also appointed to the Insulectro Advisory Board is Jeff Doubrava. Doubrava’s career has been focused on the electronics industry, developing materials that enable production of advanced components and driving the growth of the key electronic materials suppliers.  As Managing Partner of Prismark, Jeff led the company’s electronic materials practice helping to enable the growth of client companies across the world by means of share gain, entry into new markets or major acquisitions.  Prior to joining Prismark, Jeff spent twenty years with Shipley in an array of technology, business and sales roles, most recently as the Global Business Director of its PCB Materials business where he was involved in a series of transformational acquisitions. 

Jeff holds a BA in Chemistry from the University of Rochester and an MBA from Babson College.  He holds several US patents for his development of enabling electronic materials. Jeff and his family live in south coastal Massachusetts, where he is a sailor and part-time boat builder as well as an active member of town government and land conservation groups.

“Insulectro is honored to welcome these two highly accomplished individuals to the Insulectro family. For many years, Joan and Jeff have helped shape the industry with their leadership, insight, and professional accomplishments, especially with the impressive array of patents each has developed,” remarked Insulectro President and CEO, Patrick Redfern.  “Jeff and Joan join fellow Board Members John Odom, and Randy Friedman. We are fortunate to have such a powerhouse team of advisors, unrivalled in the industry.”

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326  

[email protected]

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INSULECTRO PRINTED ELECTRONICS DISTRIBUTES FLEXCON PRODUCTS

“Insulectro Printed Electronics has had a fantastic year distributing DuPont conductive inks and pastes and a wide array of best-in-class, advanced substrates,” announced Tim Redfern, President of Insulectro Printed Electronics, “I am pleased to announce the addition of FLEXcon to our list of world-class suppliers.”

 FLEXcon’s SWITCHmark® is a line of high-performance spacer components and laminating adhesives engineered for demanding membrane switch applications that face hostile environments such as moisture and solvents. Color-coded release liners on popular constructions ensure accurate product identification and mistake proofing during switch assembly. They offer a wide range of standard and custom product constructions, allowing customers the design flexibility to meet their application requirements with one adhesive system. These products meet UL Recognition under UL 746C (Polymeric Adhesive Systems, Electrical-Component) and UL 969 (Marking Labeling Systems Material Components).  

“The Printed Electronics team is excited to participate and support this product line for the Printed electronics industry in the United States and Canada Please call INSULECTRO with any questions regarding this PSA offering,” enthused Insulectro Vice President of Sales Kevin Miller.

“For over 65 years, FLEXcon has been creating value-added solutions with pressure-sensitive films and adhesives. Design engineers have turned to FLEXcon because they have the materials knowledge, technical capability and applications expertise needed to develop innovative solutions that meet the full range of production and end-use challenges,” Miller continued.

Insulectro Printed Electronics offers products from such premium brands as DuPont (Dupont Teijin Films™, Intexar® wearable stretchable ink systems, Tedlar®, and Kapton®), Coveme, Kodak, 3M, Saint-Gobain, TCI, Sabic, and Chemours – and now FLEXcon. Products include a diverse array of polyester materials, polyimide, FEP, PTFE, and PFA. Insulectro also offers its own line of polycarbonate products under the Clarity™ brand.

In addition to inks and substrates, Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech Chemicals, JX Nippon, TADCO, EMD Performance Materials, InduBond®, Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326   [email protected]

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INSULECTRO TO PRESENT ACCLAIMED POWER CHATS™ AT IPC APEX EXPO

Insulectro has announced a blow-out schedule of its highly anticipated 13.5-minute power chats in cooperation with DuPont, Isola, InduBond® and EMD Electronics during this year’s IPC APEX EXPO at the San Diego Convention Center, January 25- 27.

With top execs and engineers presenting on such breakthrough topics as 5G, Automotive, and the introduction of new Films and Laminates, the Insulectro Power Chats™, branded [email protected], will be presented in a three-quarter round theatre presentation in Insulectro’s 1800 square foot mega-booth – #3233, the largest exhibit in the suppliers and materials section.

“We are pleased to take our [email protected] – Insulectro Power Chats, to the next level with our valued suppliers, DuPont, Isola, and EMD by presenting a new topic every 30 minutes” commented Ken Parent, Chief Operating Officer, “We have 35 amazing presentations that should be of top interest to fabricators, designers, and OEMs. The Chats are topical, short, info-packed learning sessions presented by experts in the field during IPC APEX EXPO. In 13.5 minutes per Chat, attendees will learn the WHAT/WHY/HOW of these industry game changers.” The Power Chats will rotate and repeat during the show’s three days of exhibition.

 “These key suppliers are leading the pack with cutting edge engineering on new technologies that are expected to have a major impact on everyone’s life,” stated Michelle Walsh, Insulectro Vice President of Product Management, who also moderates the sessions, “To accommodate the demand, our Power Chats™ are likely to generate, we’ve increased our exhibit space substantially to create a theatrical, but safe,  environment for presenter and audience alike.

“Of particular note, Andy Kannurpatti, DuPont Business Director ICS is scheduled to present: “DuPont—Partnering with Customers to Provide Sustainable Materials Solutions for Advanced Interconnects” at 2:00 pm on January 25, repeating at 11:00 am on January 26.

“Another “don’t want to miss” Power Chat™: Isola President & CEO Travis Kelly will speak out for the newly minted PCB advocacy group PCBAA. His topic, “Confronting Our Industry’s Supply Chain Challenges”, will be presented at 11:00 am on January 25, repeating at 2:00 pm on January 26 also in booth #3233.”

Ken continued, “We are pleased also to introduce Victor Lazáro Gallego, inventor of the InduBond® induction press to North American fabricators. Victor, who is Technical Director for InduBond® for Chemplate Materials, S.L. in Barcelona, Spain, will present a Power Chat™ on ‘Indubond® Lamination, Registration, and Automation.’ Victor will be presenting 4:00 pm on January 25, and 11:30 am on January 26.”

“We’re delighted to bring many of these presenters and topics to IPC, for the first time, to explore both the far-reaching vision and new technologies and products that are being developed. It’s a great chance to experience how industry visionaries think about the future. Over the past nine years, our IPC Power Chats have been enormously popular. Most times, it’s standing room only. That’s due to the intriguing topics we spotlight in our chats and in our booth. This year promises to be no exception,” Walsh concluded.

[email protected] Power Chats™

Topics and Schedule for Booth #3233:

(Business Card drawing for Amazon Echo Dot, Google Nest Mini at conclusion of each session)

VISION

DuPont—Partnering with Customers to Provide Sustainable Materials Solutions for Advanced Interconnects

To address growing megatrends such as 5G connectivity and electric/autonomous vehicles, the printed circuit board industry must address issues such as reliable signal integrity and thermal management and do so with sustainable solutions. In this presentation, learn how DuPont is partnering with customers to provide critical interconnect solutions by leveraging its broad, growing and sustainable portfolio, deep material and applied science expertise.

Andy Kannurpatti, Global Business Director – DuPont ICS Films & Laminates

Confronting Our industry’s Supply Chain Challenges

From everyday consumer products to critical national defense systems, printed circuit boards are the electronic foundation of our modern world. Over the past 20 years, PCB production has moved away from the United States at an alarming rate, and more must be done to level the playing field and balance the sources of PCBs.

Travis Kelly, President & CEO – Isola Group

Explore Isola’s New QTA Facility

Isola bucked the trend by opening a new state-of-the-art Quick Turn Center in Chandler, AZ. The first in North America in years. Take a look at what this means for you.

Jim Hartzell, VP of OEM Marketing – Isola Group

MATERIALS & SELECTION

OEMs’ Guide to Materials Selections

Material Decisions Affect Performance, Price, and Producibility of Our Circuits. Our PCB/PCA products are used in so many industry sectors, with varied types of circuitry with so many different manufacturing considerations. Never let someone unqualified make these decisions for your company. Make the right informed choice by looking at all perspectives.

Michael Creeden CID+ MIT , Insulectro Technical Director

New Base Materials for 5G Telecommunications

5G telecommunications encompass a broad range of operating frequencies. For high band applications, new base materials are needed to support high-speed digital signal transmission, where requirements for Dk and Df exceed the today’s capability of conventional base materials. These emerging requirements make every component of the base material critical – the resin system, fillers, flame retardants, reinforcements, and copper foils. Integrating these raw materials into products that meet signal integrity requirements while also meeting reliability, CAF resistance and processability needs will be addressed.

Ed Kelley, CTO – Isola Group

You Need DuPont™ Interra™ More Than Ever!

Learn how DuPont’s Interra™ line of thin embedded capacitor materials can improve power distribution networks by lowering the overall impedance and allow design flexibility for component placements due to the reduced number of discrete capacitors required.

Greg Roettger, Key Account Manager, DuPont CPM

New Offerings in Metallization Chemistry

From high volume HDI to IC substrate technology, copper plating into blind via features enables a higher density of interconnects. However, one plating chemistry does not t all applications. Learn how DuPont has developed a new suite of copper via-filling products designed to meet the needs of customers.

Erik Reddington, Strategic Engagement Leader – DuPont Electronics &

Imaging

Ormet® Z-Axis Interconnects for Dense Circuits

Ormet® Z-Axis Interconnect is a game changer. The need for HDI solutions has been around for some time using traditional methods to solve the challenges. This has created challenges to the fabrication process due to stresses of multiple lamination cycles, via and material stress. Along with plating challenges for high-aspect ratio vias on high layer count boards. Come learn how Ormet® sintering paste from EMD Electronics solves all these challenges

Michael Creeden CID+ MIT , Insulectro Technical Director

TECHNOLOGY

TLPS Paste Technology – Products & Applications

Ormet® pastes are becoming a popular way to form z-axis interconnects in PCB. The paste utilizes Transient Liquid Phase Sintering technology to achieve this. By changing some of the paste attributes, it has other applications. We will review the principles of the technology and present on other ways and products used in electronic builds. Catherine Shearer, EMD Electronics & Chris Hunrath, VP of Technology – Insulectro

Where is the Energy that Our Circuits Produce?

Electro-Magnetic Theory – getting the best use from the best laminates from Isola & DuPont. In today’s high-speed and RF circuits, you are not routing interconnects, you are managing EM fields and knowing where these fields exists is paramount to Signal Integrity performance. You can use the best material, but you need to know how to get the best use from that material.

Michael Creeden CID+ MIT , Insulectro Technical Director

InduBond® Lamination, Registration, Automation

InduBond® X-PRESS lamination presses utilize a different way of producing the heat required for lamination using standard pressing methods. The innovation of this technology is that it produces heat on the laminated material, and only the laminated material, of each layer of the press pack at the same time, at the same temperature level, without any thermal conduction.

Presented by Victor Lazáro Gallego, Technical Director and InduBond® inventor at Chemplate Materials, S.L.

Copper Foils for High Speed & Fine Line (mSAP) Designs

Copper foil in PCB builds is no longer simply a matter of thickness (oz/sqft). Today, there are many foil types available. More and more designs are calling out specific foil characteristics. In this chat we will be reviewing some of the many types available and help “connect the dots” between the specs and the foil needed to deliver the design attributes.

Chris Hunrath, VP of Technology – Insulectro

Computer on Wheels – Automotive Electrification

The evolution/revolution is automotive electrification has increased the demand for highly reliable laminates that will stand up to the thermal demands of the hostile environments found under the hood.

Steve Sekanina, Director HSD Products – Isola Group

High Temperature Lamination and Fusion Bonding

High temperature thermoplastic materials have found their way into PCB builds. They have some unique signal characteristics as well as applications in flexible circuit technology. In this chat we will discuss some of the material sets, lamination and other processing at the PCB fabricator.

Chris Hunrath, VP of Technology – Insulectro

PRINTED ELECTRONICS

Advancements in Ag/AgCl for Bio & E-Health

DuPont has expanded its portfolio of printable Ag/AgCl and carbon pastes for biomedical sensors, health patches, and test strips. These new pastes show improved properties such as solvent resistance, better printability, flexibility/bendability, paste stability, and accurate/stable electrode performance.

HV Tran, DuPont MCM Technology

Polyimide Pastes for High Temperature Applications

To meet our customers’ needs for applications requiring electronic ink with high thermal/chemical resistance on ex/rigid substrates, DuPont has developed direct printable polyimide dielectrics, resistors, and conductors. Learn about the technical features, product benefits, and potential applications of the new KA series.

HV Tran, DuPont MCM Technology

DESIGN EDUCATION

Success! Working with your Fabrication Supply Chain

With increasing challenges in our circuit requirements, the danger of delaying fabricator involvement can significantly reduce reliability and producibility, resulting in lower yields and higher costs. When circuits are in development the circuit boards should not be considered a commodity rather, they require proactive co-engineering with your supply chain. This success can reduce costs & delays in: Material Recommendations, Stack-up Suggestions, HDI, RF, Flex, Rigid-Flex, SI & DFX. Michael Creeden CID+ MIT , Insulectro Technical Director

All Power Chats are in Space #3233 at IPC APEX EXPO. No sign-up required, and topics are repeated by your convenience. Complete schedules available in Insulectro Booth #3233, or at insulectro.com.

Insulectro supplies advanced engineered materials manufactured by Isola, DuPont®, LCOA®, CAC, Inc., Pacothane, Focus Tech Chemicals, JX Nippon, TADCO, EMD Performance Materials, InduBond®, Shikoku, Denkai America, Industrial Brush Corporation, Kemmer, and Shur-loc. These products are used by its customers to fabricate complex, multilayer circuit boards and to manufacture printed electronics components. Insulectro serves a broad customer base manufacturing rigid, rigid/flex and flexible circuit boards for applications in a variety of end markets including aeronautics, telecom, data communications, high speed computing, mobile devices, military, and medical. Insulectro combines its premier product offering with local inventory across North America, fabrication capabilities and backed up by expert customer and technical support services.

For further information, please contact:

John A. Lee

Vice President of Marketing & Brand Strategy

Insulectro

949.587.3326   [email protected]

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BIG WEEK FOR EQUIPMENT MANUFACTURER INDUBOND®

On Tuesday, November 16, Productronica 2021 in Munich, Germany, opened its doors to an eager audience looking for some sense of normality at the continent’s biggest electronics exhibition. InduBond® was in the thick of things showing their new double-entry X-Press 360, which uses a revolutionary new way of laminating PCBs. The press uses induction heating technology to deliver precisely the energy needed to cure the resins with no thermal delays in any direction of the stack – X, Y, and Z direction.

The press was shown with a proprietary stack-up from Insulectro named CSC (copper-steel-copper.)

InduBond® was also in the news with photographs of its massive expansion at its Barcelona HQ. The expansion will help increase capacity to match the demand this system is causing.

Lastly, InduBond’s® North American distributor, Insulectro, has announced its first sale of the X-Press 360 system to premiere fabricator APCT in Southern California – a harbinger of what’s to come as the NA PCB market becomes aware of the unique capabilities of InduBond® and its lamination and automation equipment.

Click here to explore InduBond’s product line