THERMOPADS™
Description
THERMOPADS™ are designed to be integrated into the lamination systems of High Speed Circuits in particular HDI Flexible Circuits that require functional performance under high temperatures and still offer a degree of Macro Z-Axis pressure distribution (conformability), that is not available from make shift alternatives or the typical harder base polymers offered in typical high temperature press pads. Designed to be used with THERMOFILM™, it offers a consistent performance under the harsh conditions of High Temperatures above 280°C.
Key Properties
- Operating Temperatures up to 600°F (316°C) for extended press cycles
- Thickness is .044″ (1.117mm)
- Predictable Control of Heat Rise excellent Thermal Conductivity due to Select uniform fiber distribution and controlled thickness and weight specifications of the Press Pad Design
Documentation
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