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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • CELANESE MICROMAX®
      • ARLON ELECTRONIC MATERIALS
      • EMC (ELITE MATERIALS COMPANY)
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUSTECH™
      • AI TECHNOLOGY, INC.
      • INDUBOND®
      • KYOCERA
      • CHANG CHUN PETROCHEMICAL
      • DENKAI AMERICA
      • JX METALS CORPORATION
      • MITSUI KINZOKU
      • SHIKOKU
      • INTERNATIONAL BRUSH CORPORATION
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
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    • PUMANEWS™ Magazine
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suppliers

CAC, Inc.

About CAC, INC.

CAC, Inc. is the manufacturer of CAC (Copper Aluminum Copper) and CSC (Copper Steel Copper).

Produced in a clean room environment to your specifications.

Product Lines

CAC Aluminum Foils

Enables drilling consistent, high-quality holes, reduces heat, eliminates burrs, and

improves hole location.  CAC aluminum is cleaned, tooled and sheeted, and this material is manufactured to the highest standards, ensuring consistent quality.

Our solid aluminum is available in 3 thicknesses to match specific drilling or lamination needs, cut and tooled to individual requirements.  The high Brinell hardness, high-yield and shear strength make it and excellent choice for both drilling and lamination requirements.

All of our solid aluminum is tension leveled and degreased for contamination-free holes, closer tolerances and improved hole location (or registration) when used in lamination.  Our aluminum is 100% recyclable, helping to support any environmental concerns.

Product Details
CAC Lamination Separators

CAC (Copper Aluminum Copper) is a thin Aluminum/Steel separator with an impressive difference… it is sandwiched between two sheets of Copper foil, which pre-seals the critical copper surfaces from exposure to airborne particles and resin dust.  During multilayer lamination, the copper foil releases from the aluminum/steel separator sheet and becomes the outer layer foil for the printed circuit board, above and below.

The proprietary CAC process ensures that the copper surfaces are free of any particles or dents five microns or larger. The net result is consistently higher yields on high density, fine line and gold feature circuit boards.

Costly manual handling and cleaning steps are eliminated, which reduces labor costs and improves cycle time and throughput during the lay-up process. CAC is also the best and most economical solution for using difficult to handle thin foils, reverse treated and double treated copper foils.

Product Details
CAC Duofoil/RCA (Release Coated Aluminum)

Duofoil is a reusable multilayer separator surfaced with a special non-stick, non-transferable, NASA approved, low friction coating, which eliminates costly stainless steel separator plates and release sheets.  Duofoil allows the use of exact size copper during lamination, further reducing raw material costs.

Duofoil allow dramatically improved throughput by substantially increasing the number of boards per press opening.

Duofoil has a superior thermal conductivity and more uniform heat distribution patterns than stainless steel separator plates, helping produce more consistent boards at improved yields.

Product Details
CAC Benefits & TDS
CSC Benefits & TDS
GHS Safety Data Sheet
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