The FR406N family of no-flow and low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.
FR406 No-Flo® and FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in heat sink bonding, die cavity board (direct chip attachment) and multilayer rigid-flex applications.
- Dk : 4.3
- Df : .025
- UL: V-0
- IPC slash sheet: 4101 /21, /24, and /26.
- Tg: 170 C
- Td 300 C
- Halogen Free: No
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