An ammonium bifluoride/hydrogen peroxide based tin/solder stripper.
- Can be used in spray or immersion and for either full panel or tab stripping applications.
- Excellent for selective solder stripping applications where nickel/gold plating is present because it will not attack the nickel-plating and cause gold slivers.
- Strips tin/solder quickly and leaves the underlying copper surface clean, residue free and ready for subsequent processing.
- Can be replenished with technical grade hydrogen peroxide to extend bath life.
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