Key Properties

  • Can be used in spray or immersion and for either full panel or tab stripping applications.
  • Excellent for selective solder stripping applications where nickel/gold plating is present because it will not attack the nickel-plating and cause gold slivers.
  • Strips tin/solder quickly and leaves the underlying copper surface clean, residue free and ready for subsequent processing.
  • Can be replenished with technical grade hydrogen peroxide to extend bath life.