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  • About
    • Mission, Vision and Values
    • History
    • Memberships & Associations
    • Giving Back
    • Quality & Certifications
    • Stocking Locations
  • Products
    • Technical Design Services
      • Standard Laminates
      • High-speed Digital
      • Low-loss RF Dielectrics
      • Flexible Circuitry
      • Thermal Management
      • Power Management
      • Additive Technologies
      • Embedded Passives
    • Our Product Offerings
      • Laminates
      • Chemistry
      • Imaging
      • Copper Foil
      • Lamination Assist
      • Drilling
      • Interconnect Solutions
      • Metallization
      • Equipment
      • Substrates & Films
      • Conductive Inks
      • CAC® & CSC™
    • Suppliers
      • DUPONT™
      • CELANESE MICROMAX®
      • ARLON ELECTRONIC MATERIALS
      • EMC (ELITE MATERIALS COMPANY)
      • LCOA™
      • CAC, Inc.
      • PACOTHANE TECHNOLOGIES®
      • TADCO
      • FOCUSTECH™
      • AI TECHNOLOGY, INC.
      • INDUBOND®
      • KYOCERA
      • CHANG CHUN PETROCHEMICAL
      • DENKAI AMERICA
      • JX METALS CORPORATION
      • MITSUI KINZOKU
      • SHIKOKU
      • INTERNATIONAL BRUSH CORPORATION
      • FLEXCON
    • Product Availability
      • PumaFast™
  • Custom Services
    • Custom Services
    • PumaFast™
  • Education
  • News
    • Company News
    • Events
    • PUMANEWS™ Magazine
  • Careers
  • Customer Portal
Contact

final finishes

Insulectro offers several Final Finish options, based on application and OEM requirements.

About final finishes

Conductors on electronic devices need a solderable and or protective finish that’s conductive. We have multiple solutions and can help with selection.

custom services

  • Phosphorous Content Testing
  • Nickel/Gold thickness testing

ENIG

Duraposit™ SMT-88/Aurolectroless 520

The combination of the Duraposit SMT-88 & Aurolectroless 520 systems provides a uniform, fine-grained deposit of pure gold that is suitable for soldering and wire bonding applications.

Product Details

Hard Gold

Ronovel N

Ronovel N is a hard gold process with exceptional current density range and plating speed.

Product Details

OSP

Shikoku GliCoat® SMD F2LX

Best-in-Class OSP coating.

Product Details
Corporate Headquarters

Insulectro
20362 Windrow Drive
Lake Forest, CA 92630
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General Inquiries
Contact Us
Call (949) 587-3200

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