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Gain free access to a variety of Insulectro research, webinars and more. Below are examples of what you’ll find upon accessing the registered content.

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Recent Whitepapers

Detailing our latest findings and innovation.

Welcome to the World of Micro Electronics using Micron Interconnect

Author: Michael Creeden CID+ Technical Director Design Education

One of the main benefits of microelectronics is the ability to create circuits with devices that are
smaller, faster, and more energy efficient than traditional electronic devices. When technology
advancements require these metrics to be improved, they challenge one another. The more
gates used in an IC, increases the functionality and the power requirements, causing thermal
challenges and size increases. The industry responds by lowering the voltage requirement and
reducing the size of gates, cells, and interconnects, which now allows for an increase in all the
metrics….

OEM FORUM Virtual Power Chats™

Virtual power chats with industry guests and Insulectro experts.

DuPont Interconnect Solutions: Consumer Electronics

Balanced performance is critical.

Learn how DuPont™ Pyralux® provides Best-in-Class low-loss material solutions for high frequency applications.

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Unwrinkling Foil Profiles

Doom Your Board with Wrong Foil

Join host Ron Murdock with Insulectro Copper Foil Product Manager Mark Satchwell and Tech VP Chris Hunrath CID+.

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Power of 5

Five things you should know about PCB design and manufacturing. New insights added weekly.

Go Away Vias!

When you replace PLATED VIAS with ORMET® PASTE, you can:

Reduce plating cycles. Save time and money.
Eliminate back-drill. Improve electrical performance, save real estate.
Eliminate through holes - Increase real estate on the board. Reduce aspect ratio.
Eliminate via ﬁll and sanding– Save time and money. Reduce board handling and scaling issues caused by sanding thin subs.
Connect surface mount pads internally – Eliminate via dimples. Maintain a smooth exterior surface for RF and assembly needs.

Hybrid PCB Designs with Flex Laminates.

By designing PCBs with ﬂexible copper clad cores instead of traditional rigid cores, you can:

Carve back overall stack thickness with ﬁlm based dielectrics like DuPont™ Pyralux AP®.
Shrink your power ground planes overall height with Interra® without CAF worries.
Meet targeted electrical performance for RF and HSD designs with a Dk of 3.2 and Df of 0.0035. (DuPont™ Pyralux AP®)
Reduce CTE mismatch with a low CTE polyimide core to improve thermal reliability compared to traditional FR4 resin systems.
Reduce surface roughness of copper traces by designing with RA copper, the standard for Flexible Copper Clads. Thus, improving insertion loss.

Glossary of Industry Terms

A comprehensive list of key technical terms and definitions.

* Represents New Advanced Packaging Terms

*µBumps: Smaller copper pillars.

*300mm Bumping: Copper pillar plating across a whole 300 mm wafer.

*Advanced Packaging: Next generation of Packaging. Akin to HDI for PCB’s.

*AMARO: Automated Microelectronics Analysis and Reporting.

Annular Ring: This term refers to the copper pad area that is left after a hole is drilled through it. This ring is measured from the edge of the pad to the edge of the hole and is an important consideration in PCB design, as it allows an electrical connection to be made from one side of the hole to the other.

Anti-Solder Ball: This type of technology is commonly applied in SMT production lines with the goal of limiting the amount of tin involved in the stencil process. This is done by making a stencil on the board and creating openings at places where the solder ball tends to be produced so that the tin paste will flow to the openings.

AOI: Short for automated optical inspection, AOI refers to a type of inspection method used to find potential problems concerning soldering performance in multi-layer PCBs with components mounted on. The AOI equipment finds these issues by capturing images of the inner PCB surfaces, looking for any possible issues in terms of displacement, polarity etc.

AQL: Short for acceptance quality limit, AQL refers to the acceptable number of defective boards produced within a production run.

...and 140+ more!