Denkai America TOB-III
Description
High reliability electrodeposited copper foil for inner and outer layer applications with excellent adhesion to a wide range of resin systems with treatment on the matte side of the foil.
Key Properties
Available in:
- 12µm (3/8oz)
- 18µm (1/2oz)
- 35µm (1oz)
- 70µm (2oz)
- 105µm (3oz)
- 140µm (4oz)
- Profiles Rz down to 4.3µm > per IPC-TM 6502.2.17
- Grade 3 per IPC 4562″
Documentation
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