Denkai America MLS-MHT

Description

High-temperature stability, reverse treat electrodeposited copper foil for inner layer application compatible with high-temperature lamination, and excellent adhesion benefits with treatment on the drum or shiny side of the foil.

Key Properties

Available in:

12µm (3/8oz)
18µm (1/2oz)
35µm (1oz)
70µm (2oz)
105µm (3oz)
Profiles Rz down to 4.5µm > per IPC-TM 6502.2.17
Grade 3 per IPC 4562

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