Denkai America HP2
Description
Superior adhesion electrodeposited copper foil for outer layer application with excellent adhesion to a wide range of resin systems.
Key Properties
Available in:
- 12µm (3/8oz)
- 18µm (1/2oz)
- Profiles Rz starting at 6.4µm > per IPC-TM 6502.2.17
- Grade 3 per IPC 4562
Documentation
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