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Denkai America
About Denkai America
Denkai America is recognized as the technological leader in the manufacture of high-quality electrodeposited copper foils for the printed circuit board industry. With the strength of international scope, Denkai America produces both conventional cladding and application specific copper foils required by technology’s leading edge companies.
At Denkai America, copper foils are electroformed on revolving titanium drums, unique for the ability to deposit copper foils with a high-quality surface. Electroformed foils are then subjected to a variety of surface treating operations contingent upon end-use requirements.
Product Lines
Application:Highest peel strength, O/L bonding.
Peel strength is a critical factor when using a no flow or low flow resin system, as a failure to bond could lead to delamination in the field. Fortunately, Camden Copper HP2 is a high copper nodule density foil released to IPC 4562 grade 3 standard to solve this concern. Due to both it’s superior surface chemistry and profile it can exceed IPC4101 slash sheet minimums and be used on various resins from for epoxy, Pi, PPO PPE resins. This domestically made copper foil is available in several thickness please see the technical data sheet for details.
Application: High Temperature foil for epoxy and PI resins.
A highly versatile IPC 4562 grade 3 foil designed to support applications from standard epoxy to higher temperature polyimide resins. This foil balances bond strength and signal performance needs whilst simplifying your material needs that previously specified TOBIII separately. This domestically made copper foil is available in several thickness please see the technical data sheet for details.